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Microelectronics Failure AnalysisDVD 1Lecture 1 "Introduction to Failure Analysis" Presenter: Rich Anderson Sandia Labs In Lecture 1 Rich presents an introduction to Failure Analysis and also highlights the topics to be covered in the course. This lecture is a good overview of the FA process.
Included with this lecture, you will receive 40 presentation slides in PDF format. Lecture time is approximately 75 minutes. Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web. Lecture 2 "Basic Failure Analysis Techniques I" Presenter: Chris Henderson Semitracks Inc. In lecture 2 Chrisbegins laying out the process of FA. As his explanation unfolds he introduces many terms and concepts that will be built upon later in the course. Chris is very good at presenting complex topics in clear and simple terms, yet he manages to include many details in the process. Some of the issues covered are: Fault Isolation, Deprocessing, Inspection (PEM, liquid crystal, wet etch, dry etch, optical, SEM, microprobing, and FIB). Topics:
Included with lectures 2 and 3, you will receive 95 presentation slides in PDF format. Lecture time is approximately 75 minutes per lecture. Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web. Lecture 3 "Basic Failure Analysis Techniques II" Presenter: Chris Henderson Semitracks Inc. Lecture 3 continues with the topics listed below. Topics:
Included with lectures 2 and 3, you will receive 95 presentation slides in PDF format. Lecture time is approximately 75 minutes per lecture. Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web. |
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