Advanced materials are becoming critical for today’s microelectronic systems. As new, more powerful chip designs are introduced, they consume more power. This has made thermal management an important concern in today’s high performance systems. Systems ranging from active electronically scanned radar arrays to web servers require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the package and die. In response to critical needs, there have been revolutionary advances in thermal management materials in the last few years. There are now over 15 low-CTE, low-density materials with thermal conductivities ranging between 400 and 1700 W/m-K, and many others with somewhat lower conductivities. Some are low cost; others have the potential to be low cost in high-volume. Production applications include servers, laptops, PCBs, PCB cold plates/heat spreaders, cellular telephone base stations, hybrid electric vehicles, power modules, phased array antennas, thermal interface materials (TIMs), optoelectronic telecommunication packages, laser diode and LED packages, and plasma displays. Advanced Thermal Management and Packaging Materials is a 2 to 3 day course that covers the large and increasing number of advanced thermal management materials, and provides an in-depth discussion of properties, manufacturing processes, applications, cost, lessons learned, typical development programs, and future directions. Traditional materials are discussed for reference. Participants are invited to bring their thermal management problems for discussion. This course is designed for every manager, engineer and technician concerned with packaging materials, using semiconductor components or supplying tools to the industry.
Participants learn to develop the skills to determine which materials will be best for a given application, how to test for them, develop models for them, and implement them in the product.
Overview of Composite Materials: Participants learn the materials systems being used in the industry today.
Thermal Materials Properties: Participants learn the thermal, mechanical, and interfacial properties of both traditional packaging materials and advanced composite packaging materials.
Manufacturing Methods: Participants learn the manufacturing methods behind these materials, and cost issues associated with manufacturing.
Applications: Participants learn the applications of the materials, both for system level and package level.
Course Objectives
The seminar will provide participants with an in-depth understanding of the advanced materials.
Participants will be able to identify appropriate materials for a wide variety of packaging applications.
The seminar will identify the major materials properties of both traditional and newer composite materials.
The seminar offers the opportunity to ask specific questions to one of the world’s leading experts on thermal management materials.
Participants will be able to understand manufacturing methods for composite and traditional materials.
Participants will be able to understand the costs and implementation issues associated with a variety of materials.
Instructional Strategy
By using a combination of instruction by lecture, problem solving and question/answer sessions, participants will learn practical approaches to choosing the appropriate materials. From the very first moments of the seminar until the last sentence of the training, the driving instructional factor is application. We use instructors who are internationally recognized experts in their fields that have years of experience (both current and relevant) in this field. The course notes offer hundreds of pages of reference material the participants can use back at their daily activities.
Course Outline
Introduction
Thermal Management Problem and Packaging Problems
Heat Dissipation, Thermal Stresses, Warping
Weight
Microprocessors
Power Modules
High-Power RF
Layer Diodes
Light-Emitting Diodes (LEDs)
Plasma Displays
Liquid Crystal Displays
Mobile Electronics
MEMS Packages
High-Power Laser and RF Weapons
Solutions
Advanced Thermal Materials
Thermally-Conductive, Low-CTE PCBs
Combined Cooling Architectures
Packaging Functions
Key Trends
Packaging Design Drivers
Material Requirements
What’s Wrong with Traditional Materials?
Classes of Advanced Materials
History of Composites in Packaging
Example of Successful Advanced Thermal Management Material—Al/SiC
Typical Development Plan for Introduction of Advanced Materials in Products
Establishing Requirements
Selection of Candidate Materials
Material Property Database
Design Trades
Development of Processes
Prototype Fabrication
Qualification
Production
Future Trends
General Trends
Monolithic Materials
Reinforcements, Including Carbon Nanotubes
Matrix Materials
Polymer Matrix Composites
Metal Matrix Composites
Carbon Matrix Composites
Ceramic Matrix Composites
Solders
Thermal Interface Materials
Smart Composites and Multifunctional Materials
Processes
Summary and Conclusions
Open Discussion
In response to critical needs, there have been revolutionary advances in thermal management materials in the last few years. There are now over 15 low-CTE, low-density materials with thermal conductivities ranging between 400 and 1700 W/m-K, and many others with somewhat lower conductivities. Some are low cost. Others have the potential to be low cost in high-volume. Production applications include servers, laptops, PCBs, PCB cold plates/heat spreaders, cellular telephone base stations, hybrid electric vehicles, power modules, phased array antennas, thermal interface materials (TIMs), optoelectronic telecommunication packages, laser diode and LED packages, and plasma displays.
This course covers the large and increasing number of advanced thermal management materials, providing an in-depth discussion of properties, manufacturing processes, applications, cost, lessons learned, typical development programs, and future directions. Traditional materials are discussed for reference. Participants are invited to bring their thermal management problems for discussion.
Dr. Carl Zweben, now an independent consultant, directed development and application of advanced thermal management and packaging materials for over 30 years. He was formerly Advanced Technology Manager and Division Fellow at GE Astro Space, where he directed the Composites Center of Excellence, where he worked on low-CTE PCBs, and was the first to use Al/SiC in microelectronic and optoelectronic packaging. Other affiliations have included Du Pont, where he worked on aramid printed circuit board materials, Jet Propulsion Laboratory and the Georgia Institute of Technology NSF Packaging Research Center. Dr. Zweben was the first, and one of only two winners of both the GE One-in-a-Thousand and Engineer-of-the-Year awards. He is a Life Fellow of ASME, a Fellow of ASM and SAMPE, an Associate Fellow of AIAA, and has been a Distinguished Lecturer for AIAA and ASME. He has published and lectured widely on advanced thermal management and packaging materials.
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