MEMS Packaging Course

Instructor: Steve Groothuis

Course Overview

Microelectromechanical systems (MEMS) have captured the interest of the public with their promise to miniaturize existing systems, making them smaller, less expensive, and more reliable. MEMS devices, also known as Microsystems or Micromachines, are now being used in an increasing number of applications, including air bag sensors, Digital Light Processing™ projectors, and inkjet printers, to name a few. This course focuses on design, operation, packaging, and reliability aspects of MEMS technologies, with a particular emphasis on packaging.

Since MEMS devices have a large surface area to volume ratio, certain surface effects (e.g., electrostatics, liquid wetting) dominate volume effects (e.g., inertia or thermal mass). Finite element analysis (FEA) is an important part of MEMS design and operational simulation. The sensor technology made significant progress due to MEMS. Complexity and performance of advanced MEMS-based sensors are described by different MEMS sensor generations.

• Device Design & Processing – The course will review basic wafer processing steps for various MEMS devices including deep reactive ion etching (DRIE), wet etching, patterning, chemical mechanical planarization (CMP), and more.
• MEMS Packaging – The course will cover basic packaging concepts for MEMS devices. Assembly and packaging processes will be reviewed (e.g., structural release, cleaning, encapsulation, and testing). Various challenges associated with packaging and testing these devices will be discussed.
• MEMS Reliability – The course will review MEMS reliability issues and associated analysis/simulation techniques. MEMS reliability requires a broad understanding of physics and mechanics in order to handle the challenges during research, development, and productization. The goal of the course is to give attendees a two-day overview of MEMS technologies: Design, Manufacturing, Packaging, Reliability, Simulation, and Testing.

Our ultimate goal is to give the attendees an overview of MEMS technologies, and the design, manufacture, package, reliability, analysis and test issues associated with them. The attendees will have a more in-depth knowledge of the challenges and opportunities associated with bringing these MEMS and MST’s to market.

Course Outline

1. Introduction to MEMS Technologies
1. Basic Concepts
2. MEMS-related Definitions
1. MEMS Mechanics
1. Mechanical/Thermal
2. Microfluidics
2. MEMS Physics
1. Electrical/Optical
2. Joule Heating
3. From MEMS to NEMS
2. MEMS Device Design & Function
1. Piezoelectric Inkjet Heads
2. Accelerometers & Gyroscopes
3. Flow & Pressure Sensors
4. Micromachines & Micromotors
5. Optical Display & Switching Devices
1. RF-MEMS & MOEMS
6. Designing & Simulating Operation
7. Linear Actuation, Comb-Drive Actuation, & Resonators
3. MEMS Device Processing
1. Lithography, Patterning, & Lift-off
2. Etching
3. Deposition
4. Sacrificial & Structural Layers
4. MEMS Assembly, Packaging, & Testing
1. Packaging Types & Options
2. Structural Release
3. Die Attach Process
4. Interconnects
5. Gettering
6. Encapsulation & Capping
7. When and How Should We Test?
5. MEMS Reliability
1. Device-Level Failure Mechanisms
1. Stiction (Release- or Shock-related) and Wear
2. Particle Contamination
3. Electrostatic discharge (ESD) & Electrical Overstress (EOS)
2. Package-Level Failure Mechanisms
1. Thermomechanical Stress & Fatigue
2. Shock & Vibration
3. Moisture/Corrosion
3. Use Condition Failure Mechanisms
6. MEMS Device Trends
1. Increased Functionality
2. Spin-off Opportunities
3. New MEMS Products
7. Conclusions

Steve Groothuis - Micron Technology Inc.

Steve Groothuis received a Bachelor’s in Physics (1983) from Michigan State University and Masters in Physics (1991) from the University of Texas. He began work in the Central Packaging Group, Texas Instruments in Dallas in 1983 as a Group Member of the Technical Staff performing semiconductor package development, design, testing, and simulation. Prior to leaving TI, he managed the engineering staff in TI's Advanced Semiconductor Packaging Lab. In 1997, he was a Multiphysics Industry Specialist for ANSYS Inc. defining Computer-Aided Engineering simulation software market plans, strategic accounts management, Electronics Packaging & MEMS Device Simulation initiatives, and product development for the Electronics Industry. Currently, he is Technology CAD & Analysis Manager in the Process R&D Department at Micron Technology. His responsibilities include device and process simulations for new cell designs, supporting most aspects of semiconductor package simulations, and new technology assessments. He has published over 30 papers at various conferences in semiconductor packaging, reliability, and numerical analysis. Mr. Groothuis is a Senior Member of the IEEE and has participated in ASME and JEDEC standards committees.

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Last modified: 01/24/08