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MEMS Packaging CourseInstructor: Steve Groothuis Course Overview Microelectromechanical systems (MEMS) have captured the interest of the public with their promise to miniaturize existing systems, making them smaller, less expensive, and more reliable. MEMS devices, also known as Microsystems or Micromachines, are now being used in an increasing number of applications, including air bag sensors, Digital Light Processing™ projectors, and inkjet printers, to name a few. This course focuses on design, operation, packaging, and reliability aspects of MEMS technologies, with a particular emphasis on packaging. Since MEMS devices have a large surface area to volume ratio, certain surface effects (e.g., electrostatics, liquid wetting) dominate volume effects (e.g., inertia or thermal mass). Finite element analysis (FEA) is an important part of MEMS design and operational simulation. The sensor technology made significant progress due to MEMS. Complexity and performance of advanced MEMS-based sensors are described by different MEMS sensor generations.
Our ultimate goal is to give the attendees an overview of MEMS technologies, and the design, manufacture, package, reliability, analysis and test issues associated with them. The attendees will have a more in-depth knowledge of the challenges and opportunities associated with bringing these MEMS and MST’s to market. Course Outline
Steve Groothuis - Micron Technology Inc. Steve Groothuis received a Bachelor’s in Physics (1983) from Michigan State University and Masters in Physics (1991) from the University of Texas. He began work in the Central Packaging Group, Texas Instruments in Dallas in 1983 as a Group Member of the Technical Staff performing semiconductor package development, design, testing, and simulation. Prior to leaving TI, he managed the engineering staff in TI's Advanced Semiconductor Packaging Lab. In 1997, he was a Multiphysics Industry Specialist for ANSYS Inc. defining Computer-Aided Engineering simulation software market plans, strategic accounts management, Electronics Packaging & MEMS Device Simulation initiatives, and product development for the Electronics Industry. Currently, he is Technology CAD & Analysis Manager in the Process R&D Department at Micron Technology. His responsibilities include device and process simulations for new cell designs, supporting most aspects of semiconductor package simulations, and new technology assessments. He has published over 30 papers at various conferences in semiconductor packaging, reliability, and numerical analysis. Mr. Groothuis is a Senior Member of the IEEE and has participated in ASME and JEDEC standards committees. If paying by credit card, you can register online. Just click on the date of interest:
If you can't make the above course dates or location, you can click here to request a date and/or location for this course. If paying by purchase order or check, or if you would prefer to not use your credit card online, please use the printable version below. Please send in your registration by fax to (505) 858-9813 by downloading the printable version below: Registration Form for Public Courses (Printable Version) Please note that registration within 14 days of the course is subject to $100 surcharge. |
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