|
|
|
|
Please select the course of interest by clicking on the appropriate link below. ESD/Latchup Design and Technology - This course is designed for every manager, engineer, and scientist working on ESD Structure design, Process Technology, Reliability, and Failure Analysis involving ESD or Latchup. Packaging Design - This course provides an overview of the packaging design process. The course covers current packaging technologies, including chip scale packaging, Ball Grid Array technology and other current concepts. Packaging Technology - This course provides an overview of the current business climate, anticipated trends, and the associated impact on assembly/packaging roadmaps. |
Send mail to
webmaster@semitracks.com with
questions or comments about this web site.
|
