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All Upcoming Courses:August Failure and Yield Analysis: August 25-28, Hong Kong, China September FIB Technology Short Course: September 4-5, 2008, Dallas, TX Advanced Thermal Management and Packaging Materials: September 15-17, Munich, Germany Defect-Based Testing Course: September 16-17, Munich, Germany MEMS Packaging Course: September 17-19, Kuala Lumpur, Malaysia MEMS Packaging Course: September 22-24, Penang, Malaysia October Packaging Technology: October 8-10, Kuala Lumpur, Malaysia Packaging Technology: October 13-15, Penang, Malaysia Wafer Fab Processing Course: October 27-30, San Jose, California CMOS Process Integration: October 27-28, San Jose, California Bipolar and BiCMOS Process Integration: October 29-30, San Jose, California Interconnect Process Integration: October 31, San Jose, California Dynamic Random Access Memory Course: October 31, San Jose, California November Failure and Yield Analysis Short Course: November 10-13, Austin, Texas MEMS Packaging Course: November 10-11, Austin, Texas ESD Design & Technology: November 19-21, Kuala Lumpur, Malaysia February Semiconductor Reliability Short Course: February 9-11, Phoenix, Arizona |
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