LED Packaging

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In the future, solid state lighting manufacturers will focus on the development of high-power, high brightness LEDs. Since LED packaging plays a vital role in the LED supply chain, a detailed discussion of the LED package development processes and principles will benefit engineers and managers working in the industry. This course will explain, highlight, and delve deep into the entire LED package development process and will overlay principles of LED product manufacturability, reliability, and performance along the way. Fundamental interactions between the device, package, and system will be discussed. The attendee will walk away with a greater understanding and knowledge of these interactions and be able to leverage engineering decisions based on sound ideas and experiences.


Course Outline

  1. Introduction
    1. Package families
      1. Through-Hole Devices
      2. Surface Mount Devices
    2. Assembly Process Flow
    3. Technology Roadmap
    4. LED Marketing Information
  2. Specific Assembly Processes
    1. Wafer Scribing & Dicing
      1. Overview of Scribing & Dicing
      2. Saw & Laser Dicing Process & Equipment
    2. Die Bonding
      1. Overview of Die Bonding
      2. Die Bonding Materials, Process, & Bonding Equipment
    3. Interconnect
      1. Overview of wire bonding
      2. Wire Bonding Processes & Equipment
      3. Flip Chip Process & Equipment
    4. Encapsulation, Lens, & Phosphor
      1. Encapsulation Materials, Processes, & Equipment
  3. LED Development: Design for Manufacturability and Reliability
    1. DfM Concepts & Principles
    2. DfR Direction & Implementation
    3. Role of Thermal and Thermo-mechanical Simulation
  4. Summary

Instructor Profile

Steve Groothuis, M.S. Physics

steve.groothuis

Steve Groothuis received a Bachelor's in Physics (1983) from Michigan State University and Masters in Physics (1991) from the University of Texas. He began work in the Central Packaging Group, Texas Instruments in Dallas in 1983 as a Group Member of the Technical Staff performing semiconductor package development, design, testing, and simulation. Prior to leaving TI, he managed the engineering staff in TI's Advanced Semiconductor Packaging Lab. In 1997, he was a Multiphysics Industry Specialist for ANSYS Inc. defining Computer-Aided Engineering simulation software market plans, strategic accounts management, Electronics Packaging, MEMS Device Simulation initiatives, and product development for the Electronics Industry. From 2000-2008, he was with Micron Technology in positions from Senior Package Engineer in the Assembly and Packaging Department to Technology CAD, and Analysis Manager in the Process RD Department at Micron Technology. His responsibilities included device and process simulations for new cell designs, supporting most aspects of semiconductor package simulations, and new technology assessments.

Currently, Mr. Groothuis is a Principal Consulting Engineer with SimuTech Group Inc. He is actively involved in developing and winning new business opportunities for Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) consulting projects. His efforts are focused on vertical markets such as Microelectronics, Semiconductor Packaging, Wafer Fabrication, NEMS/MEMS, Nanotechnology, Solar Energy, Wind Energy, and Consumer Electronics.

He has published over 30 papers at various conferences in semiconductor packaging, reliability, and numerical analysis. Mr. Groothuis is a Senior Member of the IEEE and has participated in ASME and JEDEC standards committees.

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