Semitracks, Inc. has assembled a course on IC Packaging Design and Modeling which provides an overview of the packaging design process. The course covers current packaging technologies, including chip scale packaging, Ball Grid Array technology, and other current concepts. This class focuses on techniques and the importance of thermal and mechanical simulations. Discussions and examples will concentrate on thermal performance simulations, assembly & packaging stresses, package reliability (including solder joint fatigue simulation), and interactions between chip and package. In addition, a special section will be examples of successful wafer level simulations.

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