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This webinar will provide an overview of scanning acoustic microscopy and its uses for semiconductor and electronics failure analysis. Scanning acoustic microscopy (SAM or C-SAM as it is sometimes called) is a non-destructive technique that can help localize delaminations, interface problems, examine thermomechanical and popcorn mechanism problems, and provide quality control to manufacturing/assembly processes. We will discuss how the technique works, the basic equipment for performing the technique, and more importantly, how to interpret the images. Image interpretation is the biggest challenge with SAM, so we will delve into the issues associated with image formation, package materials and structure, and how to examine data. This webinar is a must for failure analysis engineers and technicians, reliability engineers, quality control engineers, and product engineers who read reports with this data.
- Introduction and Overview
- Physics of Acoustic Microscopy
- Sound Behavior in Materials
- Reflections and Phase Difference
- Acoustic Microscope Systems
- Transmission mode, A-mode, B-mode, C-mode
- Signals, Images, and Interpretation
- Package Structure
- Package Materials
- Signal Formation
- Image Formation
- Dealing with signal reflections, beam spreading, etc.
- MIL-STD 883 Method 2030
- Example Images
- Question and Answer Period