Can't attend the class? Purchase the manual. Each manual includes the slides as well as written material covering the course subject matter, and comes with a CD.
- CMOS and BiCMOS Process Integration Manual
- Failure and Yield Analysis Manual
- Semiconductor Reliability Manual
- IC Packaging Design and Modeling Notes
- IC Packaging Technology and Challenges Notes
- Reliability and Characterization Challenges Notes
- Wafer Fab Processing Notes