Microchip Manufacturing

Microchip Manufacturing is the first full-color title ever on semiconductor manufacturing, with over 800 color illustrations in its 562 pages.

Microchip Manufacturing is not only the newest book on the subject (2004), but is also a more introductory treatment than the 4-Volume Silicon Processing For The VLSI Series.

It should especially appeal to those peripherally involved in silicon technology who would like an overall perspective of microchip manufacturing methods.

Such microelectronic professionals include: IC designers; test and product engineers; quality and reliability personnel; technicans and field-service staff; marketing, communications, and sales representatives; IP lawyers; and technical professionals working for firms that provide equipment, materials, and services to wafer fabs. The contents of its 29 chapters are given below.

Preface
Chap. 1 The Semiconductor Industry 1
Chap. 2 Semiconductors & Basic Materials Science 15
Chap. 3 Semiconductor Devices & Integrated-Circuit Types 33
Chap. 4 Overview of Semiconductor Manufacturing 51
Chap. 5 Gases, Liquid Chemicals, & Ultrapure Water 73
Chap. 6 Vacuum Technology for ULSI Applications 87
Chap. 7 The Basics of Thin-Films 111
Chap. 8 Contamination Control & Cleaning Technology for ULSI 121
Chap. 9 Silicon: Single-Crystal Growth 145
Chap. 10 Wafer Production: From Ingot to Finished Wafer 163
Chap. 11 Diffusion 175
Chap. 12 Ion Implantation 189
Chap. 13 Oxidation 213
Chap. 14 Plasmas Used in Microchip Manufacturing 237
Chap. 15 Aluminum Thin Films & Sputter Deposition for ULSI 247
Chap. 16 Chemical Vapor Deposition of Amorphous & Poly Films 269
Chap. 17 Silicon Epitaxy & Silicon-on-Insulator 305
Chap. 18 Lithography I: Photoresist Materials & Processing 321
Chap. 19 Lithography II: Image Formation & Optical Hardware 341
Chap. 20 Lithography III: Photomasks & Next-Generation Litho 359
Chap. 21 Terminology of Etching & Wet-Chemical Etching 381
Chap. 22 Dry Etching for ULSI 391
Chap. 23 Chemical Mechanical Polishing (CMP) 417
Chap. 24 Interconnects: Cu, Low-k Dielectric, Dual Damascene 437
Chap. 25 Materials Characterization Techniques 455
Chap. 26 Wafer & Chip Testing 475
Chap. 27 Assembly & Packaging 483
Chap. 28 Wafer-Fab Operations & Yield 503
Chap. 29 Environmental, Health, & safety Issues 517
Appendices 529
Index 553
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