| Semiconductor Reliability Manual |
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The Semiconductor Reliability Manual provides an overview of the semiconductor reliability discipline. Subjects such as electromigration, hot carrier effects, stress-induced voiding, ionic contamination, package reliability, EOS/ESD, and more are covered. The manual also covers a basic treatment of statistics for semiconductor reliability. The manual is over 600 pages and is authored by Christopher L. Henderson and Thomas M. Moore. Pricing
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