CIVA Figures
Figure 1
CIVA image (low magnification) localizing open interconnect on 1.0mm ASIC IC (Photo courtesy Sandia National Labs).
Figure 2
CIVA image (medium magnification) localizing open interconnect on 1.0mm ASIC IC (Photo courtesy Sandia National Labs).
Figure 3
CIVA image (high magnification) localizing open interconnect on 1.0mm ASIC IC (Photo courtesy Sandia National Labs).
Figure 4
CIVA image (low magnification) localizing open metal1 to silicon contact on a microcontroller (Photo courtesy Sandia National Labs).
Figure 5
CIVA image (high magnification) localizing open metal1 to silicon contact on a microcontroller (Photo courtesy Sandia National Labs).
Figure 6
CIVA image (high magnification) of contact shown in Photo 5 at 90° different rotation (Photo courtesy Sandia National Labs).
Figure 7
CIVA image (low magnification) of an open exhibiting tunneling characteristics (Photo courtesy Sandia National Labs).
Figure 8
CIVA image (high magnification) of an open exhibiting tunneling characteristics (Photo courtesy Sandia National Labs).
Figure 9
CIVA image (low magnification) at 300eV on a depassivated IC (Photo courtesy Sandia National Labs).
Figure 10
CIVA image (high magnification) at 300eV on a depassivated IC (Photo courtesy Sandia National Labs).
Figure 11
Raw CIVA image (low magnification) localizing open metal as a result of electrical overstress on a bipolar IC (Photo courtesy Sandia National Labs).
Figure 12
Combined CIVA and secondary image (high magnification) localizing open metal as a result of electrical overstress on a bipolar IC (Photo courtesy Sandia National Labs).
Figure 13
CIVA image (low magnification) localizing an open metal 2 to metal 3 via on a 486 class microprocessor (Photo courtesy Intel Corporation).
Figure 14
CIVA image (higher magnification) localizing an open metal 2 to metal 3 via on a 486 class microprocessor (Photo courtesy Sandia National Labs).
Figure 15
Four pane CIVA image localizing an open metal 1 step on a 3.0mm ASIC IC (Photo courtesy Sandia National Labs).
Figure 16
Raw CIVA image (low magnification) localizing an open metal 1 to metal 2 via on a 386 class embedded processor (Photo courtesy Intel Corporation).
Figure 17
Raw CIVA image (medium magnification) localizing an open metal 1 to metal 2 via on a 386 class embedded processor (Photo courtesy Intel Corporation).
Figure 18
Raw CIVA image (high magnification) localizing an open metal 1 to metal 2 via on a 386 class embedded processor (Photo courtesy Intel Corporation).
