CIVA Figures

CIVA image (low magnification) localizing open interconnect on 1.0mm ASIC IC (Photo courtesy Sandia National Labs).




CIVA image (medium magnification) localizing open interconnect on 1.0mm ASIC IC (Photo courtesy Sandia National Labs).




CIVA image (high magnification) localizing open interconnect on 1.0mm ASIC IC (Photo courtesy Sandia National Labs).




CIVA image (low magnification) localizing open metal1 to silicon contact on a microcontroller (Photo courtesy Sandia National Labs).




CIVA image (high magnification) localizing open metal1 to silicon contact on a microcontroller (Photo courtesy Sandia National Labs).




CIVA image (high magnification) of contact shown in Photo 5 at 90° different rotation (Photo courtesy Sandia National Labs).




CIVA image (low magnification) of an open exhibiting tunneling characteristics (Photo courtesy Sandia National Labs).




CIVA image (high magnification) of an open exhibiting tunneling characteristics (Photo courtesy Sandia National Labs).




CIVA image (low magnification) at 300eV on a depassivated IC (Photo courtesy Sandia National Labs).




CIVA image (high magnification) at 300eV on a depassivated IC (Photo courtesy Sandia National Labs).




Raw CIVA image (low magnification) localizing open metal as a result of electrical overstress on a bipolar IC (Photo courtesy Sandia National Labs).




Combined CIVA and secondary image (high magnification) localizing open metal as a result of electrical overstress on a bipolar IC (Photo courtesy Sandia National Labs).




CIVA image (low magnification) localizing an open metal 2 to metal 3 via on a 486 class microprocessor (Photo courtesy Intel Corporation).




CIVA image (higher magnification) localizing an open metal 2 to metal 3 via on a 486 class microprocessor (Photo courtesy Sandia National Labs).




Four pane CIVA image localizing an open metal 1 step on a 3.0mm ASIC IC (Photo courtesy Sandia National Labs).




Raw CIVA image (low magnification) localizing an open metal 1 to metal 2 via on a 386 class embedded processor (Photo courtesy Intel Corporation).




Raw CIVA image (medium magnification) localizing an open metal 1 to metal 2 via on a 386 class embedded processor (Photo courtesy Intel Corporation).




Raw CIVA image (high magnification) localizing an open metal 1 to metal 2 via on a 386 class embedded processor (Photo courtesy Intel Corporation).