High Power Optical Examination Figures

Photograph of a broken wire. (Photo courtesy DM Data.)




Photograph of intermetallic formation. (Photo courtesy DM Data.)




Photograph of contamination on a bond wire. (Photo courtesy Sandia Labs.)




Photograph of contamination on the surface of the die. (Photo courtesy Sandia Labs.)




Photograph of a processing defect. (Photo courtesy DM Data.)




Photograph of a cracked die. (Photo courtesy Sandia Labs.)




Photograph of an inked die (fails testing at electrical sort. (Photo courtesy Sandia Labs.)




Photograph of melted aluminum. (Photo courtesy Sandia Labs.)




Photograph of contamination between the bond wire and the lead frame. (Photo courtesy Sandia Labs.)




Photograph of contamination between the bond wire and the die. (Photo courtesy DM Data.)




Photograph of intermetallics at package frame. (Photo courtesy DM Data.)




Photograph of a balled back wire. (Photo courtesy Sandia Labs.)




Photograph of particles on the surface of the die. (Photo courtesy Sandia Labs.)




Photograph of residue on the surface of the die. (Photo courtesy DM Data.)




Photograph of particles below the surface of the die. (Photo courtesy Sandia Labs.)




Photograph of melted silicon on an IC. (Photo courtesy DM Data.)




Photograph of melted aluminum on an IC. (Photo courtesy Sandia Labs.)




Photograph of a bond wire bridging between the bond pad and exposed metal in the wafer street. (Photo courtesy Sandia Labs.)




Photograph of incorrect placement of markings, resulting in a short. (Photo courtesy Sandia Labs.)




Higher magnification of markings shown in Figure 19. (Photo courtesy Sandia Labs.)




Photograph of missing metal 1 metal 2 vias, resulting in an open. (Photo courtesy Intel Corp.)




Higher magnification photograph of the missing vias shown in Figure 21. (Photo courtesy Intel Corp.)




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