SEM Figures
Figure 1
SEM image showing contamination bridging between a bond wire and the substrate. (Photo courtesy DM Data.).
Figure 2
SEM image showing corrosion on the bond pad. (Photo courtesy DM Data.).
Figure 3
SEM image showing dendritic growth. (Photo courtesy Analytical Solutions.).
Figure 4
SEM image showing dendritic growth at higher magnifications. (Photo courtesy Analytical Solutions.).
Figure 5
SEM image showing a cracked die. (Photo courtesy Analytical Solutions.).
Figure 6
SEM image showing contamination on a bond pad. (Photo courtesy DM Data.).
Figure 7
SEM image showing particulate contamination on the die surface. (Photo courtesy Analytical Solutions.).
Figure 8
SEM image showing a cracked die. Crack propagates into the substrate. (Photo courtesy Analytical Solutions).
Figure 9
SEM image showing voiding in the metal. (Photo courtesy Analytical Solutions).
Figure 10
SEM image showing a metal to silicon contact. (Photo courtesy Analytical Solutions).
Figure 11
SEM image showing galvanic corrosion. (Photo courtesy Analytical Solutions).
Figure 12
SEM image showing subtle electrical overstress damage. (Photo courtesy Analytical Solutions).
Figure 13
SEM image showing Fig. 12 at higher magnification. (Photo courtesy Analytical Solutions).
Figure 14
SEM image showing bond pad cratering. (Photo courtesy DM Data).
Figure 15
SEM image showing damage caused by a blunt mechanical object. (Photo courtesy Analytical Solutions).
Figure 16
SEM image showing cracks in the glass caused by electromigration. (Photo courtesy DM Data).
Figure 17
SEM image showing a pin hole in the top glass layer. (Photo courtesy Analytical Solutions).
Figure 18
SEM image showing thinning at steps, poor step coverage. (Photo courtesy DM Data).
Figure 19
SEM image showing an electron channeling pattern. (Photo courtesy Analytical Solutions).
Figure 20
SEM image showing copper leaching out on alumimun metal line as a result of moisture. (Photo courtesy Analytical Solutions).
Figure 21
EM image showing copper leaching out on an aluminum metal line at higher magnification. (Photo courtesy Analytical Solutions).
Figure 22
SEM image showing a gate oxide short at edge of poly line. (Photo courtesy Analytical Solutions).
Figure 23
SEM image showing gate oxide short at edge of poly line. (Photo courtesy Analytical Solutions).
Figure 24
SEM image showing gate oxide short at edge of poly line - different angle. (Photo courtesy Analytical Solutions).
Figure 25
SEM image showing gate oxide short sites after poly removal. (Photo courtesy Analytical Solutions).
Figure 26
SEM image showing metal 1 bridging short after metal 2 metal 1 interlevel dielectric layer removal. (Photo courtesy Analytical Solutions).
Figure 27
SEM image showing titanium-tungsten particle bridging several metal 3 lines. (Photo courtesy Sandia Labs).
Figure 28
SEM image showing a gate oxide defect before poly removal. (Photo courtesy Sandia Labs).
Figure 29
SEM image of magnetic particle bridging bond wires in a hybrid microcircuit. (Courtesy DM Data).
Figure 30
SEM image of properly bonded wires in a static RAM. (Courtesy Analytical Solutions).
Figure 31
SEM image of contamination on a bond wire. (Courtesy DM Data).
Figure 32
SEM image of bond wire that is not making connection to the bond pad as evidenced by bond wire charging positively, blurring the image. (Courtesy Analytical Solutions).
Figure 33
SEM image of contamination on a bond wire in an operational amplifier. (Courtesy DM Data).
Figure 34
SEM image of extra bond wire material in the package cavity. (Courtesy DM Data).
Figure 35
SEM image of contamination on a bond wire in an operational amplifier. (Courtesy DM Data).
Figure 36
SEM image of bond wire with a low take off angle, most likely reverse bonded. (Courtesy DM Data).
Figure 37
SEM image of a bond wire shorting to the die scribeline. (Courtesy Analytical Solutions).
Figure 38
SEM image of intermetallics on bond pad. (Courtesy DM Data).
Figure 39
SEM image showing intermetallic growth on two bond wire/bond pad interfaces. (Courtesy Analytical Solutions).
Figure 40
High magnification image of intermetallic growth. (Courtesy DM Data).
Figure 41
Figure of bond wire sheared off at heel as a result of improper operation of the wire bond tool. (Courtesy DM Data).
Figure 42
SEM image of bond wire crack just above ball. (Courtesy DM Data).
Figure 43
SEM image showing cracking at lead interface to package. (Courtesy DM Data).
Figure 44
SEM image showing contamination bridging two leads on a package. (Courtesy DM Data).
Figure 45
High magnification SEM image showing cracking at lead interface to package. (Courtesy DM Data).
Figure 46
SEM image showing etching pit into the Si substrate as a result of a breach in the overlying oxide layer. (Courtesy Analytical Solutions).
Figure 47
SEM image showing a different etching pit into the Si substrate. Note that oxide and Al were both deposited into the pit indicating that the etched pit occurred early in processing. (Courtesy Analytical Solutions).
Figure 48
SEM image showing oxide whiskers due to incorrect processing and composition. (Courtesy Analytical Solutions).
Figure 49
SEM image showing poor step coverage (breadloafing) of metal 1 into a silicon contact. (Courtesy Analytical Solutions).
Figure 50
SEM image showing overetched contact windows that undercut the field oxide. (Courtesy Analytical Solutions).
Figure 51
SEM image showing damage result from a collector to emitter short on a bipolar IC. (Courtesy Analytical Solutions).
Figure 52
SEM image showing an open metal 1 - metal 2 contact. Oxide not fully removed from contact area. (Courtesy Analytical Solutions).
Figure 53
SEM image showing an overetched metal1 - Si contact and poor oxide coverage. (Courtesy Analytical Solutions).
Figure 54
SEM image showing a metal to substrate short on a capacitor on a bipolar IC. (Courtesy Analytical Solutions).
Figure 55
Higher magnification image of the metal to substrate short. (Courtesy Analytical Solutions).
Figure 56
SEM image showing breach in the field oxide, resulting in a metal to silicon short. (Courtesy Analytical Solutions).
Figure 57
SEM image showing open metal interconnect at a step due to lack of step coverage. (Courtesy Analytical Solutions).
Figure 58
SEM image showing processing defect over the p isolation region, resulting in a short. (Courtesy Analytical Solutions).
Figure 59
SEM image showing excess copper in metallization system causing short. (Courtesy Analytical Solutions).
Figure 60
Lower magnification image showing location of shorts due to excess copper in metallization system. (Courtesy Analytical Solutions).
Figure 61
SEM image showing void in die attach. (Courtesy Analytical Solutions).
Figure 62
SEM image showing gap between lead and leadframe (potential entry point for moisture or other volatiles). (Courtesy Analytical Solutions).
Figure 63
Lower magnification image of the lead and leadframe. (Courtesy Analytical Solutions).
Figure 64
SEM image showing collector to emitter damage on a pnp transistor on a bipolar IC. (Courtesy Analytical Solutions).
Figure 65
SEM image showing blown fusible link on a read only memory. (Courtesy Analytical Solutions).
Figure 66
SEM image showing aluminum inclusions in a polysilicon gate resulting in a shorted transistor. (Courtesy Analytical Solutions).
Figure 67
Higher magnification image of aluminum inclusions into the polysilicon gate. (Courtesy Analytical Solutions).
