FMI Figures

FMI image of heat dissapation in a metal 2 - metal 1 contact test structure. (Photo courtesy Sandia Labs.).




FMI image of heat dissapation in a static RAM. (Photo courtesy Sandia Labs.).




FMI image of heat dissapation in a different static RAM. (Photo courtesy Sandia Labs.).




FMI image of heat dissapation in a metal 2 electromigration test structure. (Photo courtesy Sandia Labs.).




FMI image (100X) of heat dissapation in a 256k SRAM from a 5.9 ohm short caused by a metal 1 patterning defect. Image shows the heat generated from the short as well as current flow in the metal 3 conductors. (Photo courtesy Sandia Labs.).




Background image (100X) of the area shown in Figure 5. (Photo courtesy Sandia Labs.).




FMI image (25X) of heat dissapation in a 256k SRAM from an 8.8 ohm short caused by a metal 1 patterning defect. (Photo courtesy Sandia Labs.).




FMI image of (100X) of the above defect in Figure 7. (Photo courtesy Sandia Labs.).




FMI image of (400X) the above defect shwon in Figure 7. (Photo courtesy Sandia Labs.).




FMI image (1000X) of the above defect shown in Figure 7. (Photo courtesy Sandia Labs.).




Background image (1000X) of the area shown in the previous FMI image. The metal 1 patterning defect is seen vaguely in the center of the photograph. (Photo courtesy Sandia Labs.).




FMI image of a 2 ┬Ám BiCMOS transistor showing a 2oC temperature rise.. (Photo courtesy Lucent Technologies.).




Typical hardware setup used for Fluorescent Microthermographic imaging.. (Photo courtesy Sandia Labs.).




Spectral Irradiance of Xe (Xenon) and Hg (Mercury) arc lamps used for FMI. (Photo courtesy Oriel Corporation.).




Spectral Irradiance of Hg/Xe (Mercury/Xenon) arc lamp used for FMI. (Photo courtesy Oriel Corporation.).