Acoustic Microscopy Figures

Graph showing a C-mode time window with a good IC and a delaminated IC (the delaminated IC signal is dashed) after T. Moore.




Photograph showing delaminations at each of the corners on a PLCC package.




Photograph showing extensive delamination in the lead frame on a PLCC package.




Photograph showing a difference in delaminations between two PLCC packages.




Photograph showing good adhesion (on the left) and bad adhesion (on the right) for a TO-220 package before and after thermal cycling.




Screen shot of C-mode scanning acoustic microscope. (photo courtesy Sonix Corp.)




Screen shot of C-mode scanning acoustic microscope. (photo courtesy Sonix Corp.)




Screen shot of C-mode scanning acoustic microscope. (photo courtesy Sonix Corp.)




Screen shot of C-mode scanning acoustic microscope. (photo courtesy Sonix Corp.)




Screen shot of C-mode scanning acoustic microscope. (photo courtesy Sonix Corp.)