Acoustic Microscopy Figures
Figure 1
Graph showing a C-mode time window with a good IC and a delaminated IC (the delaminated IC signal is dashed) after T. Moore.
Figure 2
Photograph showing delaminations at each of the corners on a PLCC package.
Figure 3
Photograph showing extensive delamination in the lead frame on a PLCC package.
Figure 4
Photograph showing a difference in delaminations between two PLCC packages.
Figure 5
Photograph showing good adhesion (on the left) and bad adhesion (on the right) for a TO-220 package before and after thermal cycling.
Figure 6
Screen shot of C-mode scanning acoustic microscope. (photo courtesy Sonix Corp.)
Figure 7
Screen shot of C-mode scanning acoustic microscope. (photo courtesy Sonix Corp.)
Figure 8
Screen shot of C-mode scanning acoustic microscope. (photo courtesy Sonix Corp.)
Figure 9
Screen shot of C-mode scanning acoustic microscope. (photo courtesy Sonix Corp.)
Figure 10
Screen shot of C-mode scanning acoustic microscope. (photo courtesy Sonix Corp.)
