Delid and Decap Figures
Figure 1
Shows a view of the cavity of a device successfully delidded without damage to wirebond loops. Photo courtesy of Analytical Solutions, Inc.
Figure 2
Shows a cross sectional view of this structure. Photo courtesy of Analytical Solutions, Inc.
Figure 3
Shows a CERDIP package which was decapsulated by breaking the cover off the package. Photo courtesy of Analytical Solutions, Inc.
Figure 4
Shows a package which was opened with a can opener device. Photo courtesy of Analytical Solutions, Inc.
Figure 5
Shows a die which was decapsulated using the jet etch technique. Photo courtesy of Analytical Solutions, Inc.
Figure 6
Shows a close-up view of a similar package, decapsulated using the jet etch technique. Photo courtesy of Analytical Solutions, Inc.
