External Visual Figures

Reject criteria for external visual examination.




Reject criteria for external visual examination.




Reject criteria for external visual examination.




Reject criteria for external visual examination.




Reject criteria for external visual examination.




Reject criteria for external visual examination.




Reject criteria for external visual examination.




Reject criteria for external visual examination.




Reject criteria for external visual examination.




Reject criteria for external visual examination.




An example of a bad lid seal on an IC. (Photo courtesy Sandia Labs).




An example of contamination on the package. (Photo courtesy Sandia Labs).




An example of the markings you might encounter on an IC. (Photo courtesy Analytical Solutions).




An example of contamination bridging two or more leads on an IC. (Photo courtesy Sandia Labs).




An example of a solder bridge on an IC. (Photo courtesy Sandia Labs).




Low power optical photograph showing an example of markings on an IC. (Photo courtesy Sandia Labs).




An example of a package lid seal gap on an IC. (Photo courtesy Sandia Labs).




An example of a broken lead on an IC. (Photo courtesy Sandia Labs).




An example of a 16 pin ceramic lid flatpack IC. (Photo courtesy Sandia Labs).




An example of a 44 pin leadless chip carrier IC. (Photo courtesy Sandia Labs).




An example of a 24 pin ceramic dual inline packaged (CERDIP) IC. (Photo courtesy Sandia Labs).




Low magnification photograph of a solder bridge on an IC. (Photo courtesy Sandia Labs).




An example of a bad lid seal on an IC. (Photo courtesy Sandia Labs).