Low Power Optical Examination Figures

Photograph of open bond wires. (Photo courtesy Sandia Labs).




Photograph of two wires shorted together. (Photo courtesy Sandia Labs).




Photograph of misbonded wires. (Photo courtesy Sandia Labs).




Photograph of an IC with the wrong number of bond wires. (Photo courtesy Sandia Labs).




Photograph of a cracked die. (Photo courtesy DM Data).




Photograph of die contamination. (Photo courtesy DM Data).




Photograph of thermal damage on a die. (Photo courtesy DM Data).




Photograph of contamination in the package cavity. (Photo courtesy Sandia Labs).




Photograph of die fractured due to die shear. (Photo courtesy DM Data).