X-Ray Radiography Figures
Figure 1
X-ray image showing a Dual In-line Package (DIP) which has a crack running through the ceramic body. This radiograph was produced on a positive acting Polaroid print medium. (Courtesy Sandia Labs).
Figure 2
X-ray image showing an enlargement of a portion of a package cavity, showing directional voiding occurring in a silicon-gold eutectic die attach process. This radiograph was produced on fine grained Xray film and reproduced by backlighting and photographing the negative. (Courtesy Sandia Labs).
Figure 3
X-ray image showing a Leadless Chip Carrier (LCC) which had a ceramic lid sealed to it using gold-tin eutectic solder in a heated platen sealer. The defect in the lower left corner resulted from a raised corner on the lid which caused a breach in the solder seal. (Courtesy Sandia Labs).
Figure 4
X-ray image showing a very porous and poorly wetted seal ring following lid sealing. Note that die attach detail is also revealed. (Courtesy Sandia Labs).
Figure 5
X-ray image showing porosity evident in the fillet region of a ceramic package sealed with a metal lid. This porosity was not typical, and indicated a material problem. (Courtesy Sandia Labs).
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