Microchip Manufacturing is the first full-color title ever on semiconductor manufacturing, with over 800 color illustrations in its 562 pages.
Microchip Manufacturing is not only the newest book on the subject (2004), but is also a more introductory treatment than the 4-Volume Silicon Processing For The VLSI Series.
It should especially appeal to those peripherally involved in silicon technology who would like an overall perspective of microchip manufacturing methods.
Such microelectronic professionals include: IC designers; test and product engineers; quality and reliability personnel; technicans and field-service staff; marketing, communications, and sales representatives; IP lawyers; and technical professionals working for firms that provide equipment, materials, and services to wafer fabs. The contents of its 29 chapters are given below.
|Chap. 1||The Semiconductor Industry||1|
|Chap. 2||Semiconductors & Basic Materials Science||15|
|Chap. 3||Semiconductor Devices & Integrated-Circuit Types||33|
|Chap. 4||Overview of Semiconductor Manufacturing||51|
|Chap. 5||Gases, Liquid Chemicals, & Ultrapure Water||73|
|Chap. 6||Vacuum Technology for ULSI Applications||87|
|Chap. 7||The Basics of Thin-Films||111|
|Chap. 8||Contamination Control & Cleaning Technology for ULSI||121|
|Chap. 9||Silicon: Single-Crystal Growth||145|
|Chap. 10||Wafer Production: From Ingot to Finished Wafer||163|
|Chap. 12||Ion Implantation||189|
|Chap. 14||Plasmas Used in Microchip Manufacturing||237|
|Chap. 15||Aluminum Thin Films & Sputter Deposition for ULSI||247|
|Chap. 16||Chemical Vapor Deposition of Amorphous & Poly Films||269|
|Chap. 17||Silicon Epitaxy & Silicon-on-Insulator||305|
|Chap. 18||Lithography I: Photoresist Materials & Processing||321|
|Chap. 19||Lithography II: Image Formation & Optical Hardware||341|
|Chap. 20||Lithography III: Photomasks & Next-Generation Litho||359|
|Chap. 21||Terminology of Etching & Wet-Chemical Etching||381|
|Chap. 22||Dry Etching for ULSI||391|
|Chap. 23||Chemical Mechanical Polishing (CMP)||417|
|Chap. 24||Interconnects: Cu, Low-k Dielectric, Dual Damascene||437|
|Chap. 25||Materials Characterization Techniques||455|
|Chap. 26||Wafer & Chip Testing||475|
|Chap. 27||Assembly & Packaging||483|
|Chap. 28||Wafer-Fab Operations & Yield||503|
|Chap. 29||Environmental, Health, & safety Issues||517|