Low Power Optical Examination Figures
Figure 1
Photograph of open bond wires. (Photo courtesy Sandia Labs).
Figure 2
Photograph of two wires shorted together. (Photo courtesy Sandia Labs).
Figure 3
Photograph of misbonded wires. (Photo courtesy Sandia Labs).
Figure 4
Photograph of an IC with the wrong number of bond wires. (Photo courtesy Sandia Labs).
Figure 5
Photograph of a cracked die. (Photo courtesy DM Data).
Figure 6
Photograph of die contamination. (Photo courtesy DM Data).
Figure 7
Photograph of thermal damage on a die. (Photo courtesy DM Data).
Figure 8
Photograph of contamination in the package cavity. (Photo courtesy Sandia Labs).
Figure 9
Photograph of die fractured due to die shear. (Photo courtesy DM Data).
