Can't attend the class? Purchase the manual. Each manual includes the slides as well as written material covering the course subject matter, and comes with a CD.

• Failure and Yield Analysis Course Manual

• CMOS and BiCMOS Process Integration Course Manual

• Reliability and Characterization Challenges Manual

• Semiconductor Reliability Course Manual

• Semiconductor Technology Manual (we are currently re-writing this manual)

• Microchip Manufacturing (Hardbound Book)

• Wafer Fab Processing Course Notes

• Reliability and Characterization Challenges Course Notes (2007)

• IC Packaging Design and Modeling Course Notes

• IC Packaging Technology and Challenges Course Notes

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Last modified: 01/24/08