Education and Training for the Electronics Industry
Semitracks provides education, training, and certification services and products for the electronics industry. We specialize in serving Semiconductor, Microsystems and Nanotechnology suppliers and users. Semitracks, Inc. helps engineers, technicians, scientists, and management understand these dynamic fields. We offer courses in Semiconductor Reliability, Test, Packaging, Process Integration, Failure and Yield Analysis, and Focused Ion Beam technology. Learn from the Experts.
When a high energy neutron impinges on a boron-10 atom, basically one reaction occurs. The by-products are a lithium-7 ion and an alpha particle. Boron-10 is of interest to semiconductor community because it is present in borophosphosilicate glasses or BPSG. Approximately 90% of all boron-10 fissions are caused by lower energy neutrons, neutrons with energies below about 15 MeV. One major concern with the materials used in the fabrication of integrated circuits is boron. Boron is used in phosphosilicate glass (BPSG). If the boron is implanted, boron-11 can be implanted to the exclusion of boron-10, since it occurs in an ion implanter. If the oxide is grown via chemical vapor deposition, like BF2, then boron-10 can be incorporated into the glass. Boron-10 has a high neutron capture cross-section, making it susceptible to generating alpha particles and heavy ions.
Semitracks' new and improved Online Training is convenient, up-to-date, and cost effective. Access the same material presented in our courses whenever you need it, right when you need it without having to worry about the high costs and hassle of traveling. The semiconductor field is an ever-changing one. With access to the most current information, you can stay on top of the new technology. Online Training is also very cost effective. For only $500 per year, you gain access to thousands of dollars worth of courses and course material.
Give our Online Training a try – for free. This month's topic is Memory Troubleshooting.
Memory troubleshooting is relatively straightforward; however, there are some issues of which to be aware. One important issue is the translation from an electrical map to a physical map. This segment describes the process and gives an example.
This segment is no longer available. If this topic interests you, perhaps you would be interested in our Online Training. For more information or to sign up, please visit http://www.semitracks.com/online-training/.
International Reliability Physics Symposium
March 26-30, 2006 at the San Jose McEnery Convention Center in San Jose, CA, USA
To view the AMFA website at http://www.amfaworkshop.org/.
March 31, 2006 at the San Jose McEnery Convention Center in San Jose, CA, USA
Christopher Henderson, President of Semitracks, Inc., will be presenting a paper at this conference.
Semicon West 2006
July 10-14, 2006 at Moscone Center in San Francisco, CA, USA
Reliability is a critical element to the success of any semiconductor product. Reliability margins are increasingly squeezed by today's deep submicron technologies. Learn about the major reliability failure mechanisms, test structures, and test equipment. Also, learn how to optimize reliability, performance, and cost.
Semiconductor Reliability on May 10-12, 2006 at the Hilton, Am Tucherpark in Munich, Germany
Invest in yourself and your staff. Time is running short to enroll in our Summer courses on Packing Technology, Packaging Design, Process Integration, Reliability, and Failure and Yield Analysis. Come and learn from the experts!
Packaging Technology and Challenges
Semitracks, Inc. and Semiconductor International have put together a course which will provide an overview of the current business climate, anticipated trends and the associated impact on assembly/packaging roadmaps. There will be an in depth discussion of both high-end CPU roadmaps plus the roadmaps to address the multitude of communications and network devices that are driving the digital revolution.
Packaging Technology and Challenges on May 8-9, 2006 in Munich, Germany
Packaging Design and Modeling
Semitracks, Inc. and Semiconductor International have assembled a course on IC Packaging Design and Modeling. This course provides an overview of the packaging design process. The course covers current packaging technologies, including chip scale packaging, Ball Grid Array technology and other current concepts. This class focuses on techniques and the importance of thermal and mechanical simulations. Discussions and examples will concentrate on thermal performance simulations, assembly & packaging stresses, package reliability (including solder joint fatigue simulation), and interactions between chip and package. In addition, a special section will be examples of successful wafer level simulations.
Packaging Design and Modeling on May 10-12, 2006 in Munich, Germany
Semiconductor Process Integration
Semitracks, along with Semiconductor International, have put together a 3-day course on Semiconductor Process Integration for CMOS, Analog, and Mixed Signal Technologies. Dr. Badih El-Kareh of Texas Instruments will give an overview of the process integration challenges associated with today's advanced semiconductor devices. Dr. El-Kareh will cover passive and active components, contact and interconnect issues, isolation technologies such as STI and SOI, transistor integration issues, as well as full CMOS, BiCMOS and High-Speed Bipolar Process Integration techniques.
Process Integration on May 15-17, 2006 in Munich, Germany
Failure and Yield Analysis Course
Failure and Yield Analysis is an increasingly difficult and complex process; engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of disciplines in order to effectively perform failure analysis. This requires knowledge of subjects like: design, testing, technology, processing, materials science, chemistry, and even optics! Failed devices and low yields can lead to customer returns and idle manufacturing lines that can cost a company millions of dollars a day. Your industry needs competent analysts to help solve these problems. This is a multi-day course that offers detailed instruction on a variety of effective tools, as well as the overall process flow for locating and characterizing the defect responsible for the failure.
Failure and Yield Analysis on April 24-27, 2006 in Austin, TX, USA and on May 15-18, 2006 in Munich, Germany
If you have a suggestion or a comment regarding our courses, online training, discussion forums, reference materials, or if you wish to suggest a new course or location, please feel free to call us at 1-505-858-0454, or e-mail us at email@example.com.
Home > Newsletters > 2006 March Newsletter