Education and Training for the Electronics Industry
Semitracks provides education, training, and certification services and products for the electronics industry. We specialize in serving Semiconductor, Microsystems and Nanotechnology suppliers and users. Semitracks, Inc. helps engineers, technicians, scientists, and management understand these dynamic fields. We offer courses in Semiconductor Reliability, Test, Packaging, Process Integration, Failure and Yield Analysis, and Focused Ion Beam technology. Learn from the Experts.
Self-stressing test structures are a powerful way to examine failure mechanisms at the wafer level. Many failure mechanisms need to be evaluated under conditions as close to the use conditions as possible. In particular, one should evaluate under AC conditions. Self-stress test structures are designed to eliminate the need for high frequency cabling and the need for high temperature ovens. This is an example of a self-stressing test structure. This particular structure is used to evaluate electromigration performance at the wafer level. It utilizes an on-board polysilicon heater for temperature control and on-board oscillators to provide high frequencies to the structure. The on-board oscillator is a voltage-controlled oscillator that can produce frequencies ranging from DC to close to those of a ring oscillator manufactured in the technology. For today's high frequency designs, it can be expensive to create high frequency cabling to test structures. By using a self-stressing test structure, one only need supply DC voltages to the structure in order to generate the high frequencies. This can permit testing of many devices in many configurations in a fraction of the time necessary using conventional reliability test techniques.
Semitracks' new and improved Online Training is convenient, up-to-date, and cost effective. Access the same material presented in our courses whenever you need it, right when you need it without having to worry about the high costs and hassle of traveling. The semiconductor field is an ever-changing one. With access to the most current information, you can stay on top of the new technology. Online Training is also very cost effective. For only $500 per year, you gain access to thousands of dollars worth of courses and course material.
Give our Online Training a try – for free. This month's topic is Time Resolved Emission. Time resolved emission is emerging as the best technique for obtaining waveform information from advanced integrated circuits during debug and failure analysis.
This segment is no longer available. If this topic interests you, perhaps you would be interested in our Online Training. For more information or to sign up, please visit http://www.semitracks.com/online-training/.
Semitracks, along with Semiconductor International, have put together a 2-day course on Semiconductor Process Integration for CMOS and BiCMOS Technologies. Dr. Badih El-Kareh, an independent consultant, will give an overview of the process integration challenges associated with today's advanced semiconductor devices. Dr. El-Kareh will cover passive and active components, contact and interconnect issues, isolation technologies such as STI and SOI, transistor integration issues, as well as full CMOS, BiCMOS and High-Speed Bipolar Process Integration techniques.
Process Integration on January 29-31, 2007 in Tempe, AZ, USA
Invest in yourself and your staff. Our 2007 schedule is now available, come and learn from the experts!
This intensive 4-day course offers a comprehensive examination of the wafer fab processes used to manufacture state-of-the-art microchips. Topics include semiconductor devices and ICs, silicon crystal growth and crystal defects, ion implantation, thermal processing, contamination control, wafer cleaning, LPCVD, PECVD, PVD, CMP, microlithography, etch, multilevel interconnect technology, and manufacturing technology. Process integration will be illustrated using a basic CMOS process flow.
The course is designed primarily for process engineers and process technicians. The emphasis is on understanding how each individual process step works, and understanding the key process control variables for each step. The functional design of the process tools is also discussed, as are process characterization, monitoring, and control.
Engineers new to semiconductor manufacturing will gain a solid, broad understanding of the entire wafer fab process. Engineers experienced in one or more functional areas of wafer fab will benefit from a thorough understanding of processes in other areas, as well as a better appreciation of process interactions.
Semiconductor Processing on February 26-March 1, 2007 in Santa Clara, CA, USA
Failure and Yield Analysis
Failure and Yield Analysis is an increasingly difficult and complex process; engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of disciplines in order to effectively perform failure analysis. This requires knowledge of subjects like: design, testing, technology, processing, materials science, chemistry, and even optics! Failed devices and low yields can lead to customer returns and idle manufacturing lines that can cost a company millions of dollars a day. Your industry needs competent analysts to help solve these problems. This is a multi-day course that offers detailed instruction on a variety of effective tools, as well as the overall process flow for locating and characterizing the defect responsible for the failure.
Failure and Yield Analysis on March 12-15, 2007 in Santa Clara, CA, USA
Semiconductor reliability is at a crossroads. In the past, reliability meant discovering, characterizing and modeling failure mechanisms and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability, assessing the impact of new materials, dealing with limited margins, etc. Analysis and experimentation is now performed at the wafer level instead of the packaging level. This requires knowledge of subjects like: design of experiments, testing, technology, processing, materials science, chemistry, and customer expectations. While reliability levels are at an all-time high level in the industry, rapid changes may quickly cause reliability to deteriorate. Your industry needs competent engineers and scientists to help solve these problems.
Semiconductor Reliability on March 27-29, 2007 in Santa Clara, CA, USA
Packaging Technology and Challenges
Semitracks, Inc. and Semiconductor International have put together a course which will provide an overview of the current business climate, anticipated trends and the associated impact on assembly/packaging roadmaps. There will be an in depth discussion of both high-end CPU roadmaps plus the roadmaps to address the multitude of communications and network devices that are driving the digital revolution.
Packaging Technology and Challenges on April 9-10, 2007 in Tempe, AZ, USA
Packaging Design and Modeling
Semitracks, Inc. and Semiconductor International have assembled a course on IC Packaging Design and Modeling. This course provides an overview of the packaging design process. The course covers current packaging technologies, including chip scale packaging, Ball Grid Array technology and other current concepts. This class focuses on techniques and the importance of thermal and mechanical simulations. Discussions and examples will concentrate on thermal performance simulations, assembly & packaging stresses, package reliability (including solder joint fatigue simulation), and interactions between chip and package. In addition, a special section will be examples of successful wafer level simulations.
Packaging Design and Modeling on April 11-13, 2007 in Tempe, AZ, USA
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