gate n - an electrode that regulates the flow of current in a metal oxide semiconductor transistor. [SEMATECH]
gate electrode n - the electrode of a metal oxide semiconductor field effect transistor (MOSFET); it controls the flow of electrical current between the source and the drain. [SEMATECH]
gate oxide n - a thin, high-quality silicon dioxide film that separates the gate electrode of a metal oxide semiconductor transistor from the electrically conducting channel in the silicon. [SEMATECH]
glass n - a deposited film of silicon dioxide with additives to adjust coefficient of thermal expansion, color, conductivity, and melting point, generally doped with boron or phosphorus or both. [SEMATECH] Also see silicon dioxide.
groove n - in a semiconductor wafer, a shallow scratch with rounded edges that is usually the remnant of a scratch not completely removed by polishing. [SEMI M1-94 and ASTM F1241]
growth hillock - see pyramid.
hermetic sealn - a coat applied in the final stage of thermal processing to seal the ceramic package and to protect the device from the external environment. [SEMATECH]
hillock n - a defect caused by stress that raises portions of a metal (such as aluminum) film above the surface of the film. Localized stress within the metal film may elevate portions of the film through the adjacent dielectric layer, resulting in a metal extrusion and a short to the next metal layer. [SEMATECH] Also see pyramid.
hole n 1 - of a semiconductor, a mobile vacancy in the electronic valence structure that acts like a positive electron charge with positive mass; the majority carrier in p-type material.[SEMI M1-94 and ASTM F1241] 2 - in plastic and metal wafer carriers, the area through which a pin from another wafer carrier can enter for the transfer of wafers. [SEMI E1-86] Also see wafer carrier.
hot carriers n - those carriers, which may be either electrons or holes, that have been accelerated by the large traverse electric field between the source and the drain regions of a metal oxide semiconductor field-effect transistor (MOSFET). They can jeopardize the reliability of a semiconductor device when these carriers are scattered (that is, deflected) by phonons, ionized donors or acceptors, or other carriers. The scattering phenomenon can manifest itself as substrate current, gate current, or trapped charges. [SEMATECH] Also see trapped charges.
IC - see integrated circuit.
IDDQ - abbreviation for direct drain quiescent current. An electrical parameter associated with the current of a CMOS integrated circuit when in a static (quiescent) condition, that is, no changing signals applied to the IC.
impact test n - in component testing, a test performed to determine particle contribution as a result of mechanical shock to the component. [SEMATECH] Also called particle impact noise detection or PIND
implant - see ion implantation.
impurity n - a chemical or element added to silicon to change the electrical properties of the material. [SEMATECH] Also see dopant, ion implantation.
inclusion n - discrete second phases (oxides, sulfides, carbides, intermetallic compounds) that are distributed in a metal matrix. [SEMATECH]
indent n - on a semiconductor wafer, an edge defect that extends from the front surface to the back surface. [ASTM F1241] Contrast chip.
insulator n - a substance that will not conduct electricity; for example, silicon dioxide and silicon nitride. [SEMATECH] Contrast conductor.
integrated circuit (IC) n 1 - two or more interconnected circuit elements on a single die. [SEMATECH] 2 - a fabrication technology that combines most of the components of a circuit on a single-crystal silicon wafer. [SEMI Materials, Vol. 3, Definitions for Semiconductor Materials]
interference contrast microscope n - a microscope that reveals surface details of an object in which there is no appreciable absorption by using the interference between two beams of light. [Adapted from ASTM F1241] Also called Nomarski Interference Contrast
interlevel dielectrics n - an insulating film between two conductive film layers, as between poly and aluminum or between layers of aluminum. [SEMATECH]
interstitial n - in a crystalline solid, an atom that is not located on a lattice site. [SEMATECH]
intrinsic semiconductor n - a semiconductor in which the density of electrons and holes is approximately equal. [SEMATECH] Contrast extrinsic semiconductor.
ion implantation (I 2 , II) n - a high-energy process that injects an ionized species such as boron, phosphorus, arsenic, or other ions into a semiconductor substrate. [SEMATECH]
I/O pins n - connections to an integrated circuit through which input and/or output (I/O) signals pass. [1994 National Technology Roadmap for Semiconductors]
isolation n - an electrical separation of regions of silicon on a wafer; for example, boron diffusion to isolate a transistor. [SEMATECH] Also see dielectric isolation.
junction spiking n - the penetration of a junction by aluminum, which occurs when silicon near the junction dissolves in aluminum and migrates along the interconnect lines. Aluminum then replaces silicon at the junction. [SEMATECH]
Kirkendall void n - voids induced in a diffusion couple between two metals that have different interdiffusion coefficients. [SEMATECH]
large scale integration (LSI) n - the placement of at least 100 active devices on a single die. [JESD99]
laser-scattering light event n - a signal pulse that exceeds a preset threshold, generated by the interaction of a laser beam with a localized light scatterer (LLS) at a wafer surface as sensed by a detector. [ASTM F1241] Also see haze.
layout n 1 - the physical geometry of a circuit or die. [1994 National Technology Roadmap for Semiconductors] 2 - the process of creating the physical geometry of a circuit or die. [1994 National Technology Roadmap for Semiconductors] 3 - see composite drawing.
LDD - see lightly doped drain.
life test n - in semiconductor reliability, a test designed to operate the semiconductor until it fails by elevating both temperature and voltage to accelerate the aging process. [Sandia Labs]
lightly doped drain (LDD) n - a metal-oxide semiconductor (MOS) device design in which the drain doping is reduced to improve breakdown voltage. [SEMATECH]
line defect - see dislocation.
LSI - see large scale integration.
Medium Scale Integration (MSI) n - the placement of at between 12 and 100 active devices on a single die. [JESD99]
metallization void n - the absence of a clad, evaporated, plated, or screen printed metal layer or braze from a designated area. [SEMI G58-94] Also called metal void.
metal void - see metallization void.
MFM-CCI - see magnetic current imaging.
microchip - see die.
moon crater n - on a semiconductor wafer, surface texture that results when a wafer floats during the initial stages of chemical polishing in a rotating cup etcher. [ASTM F1241]
motorboat - see comet.
mottled adj - pertaining to the existence on a wafer of material in a window that prevents the window from being properly opened. [SEMATECH]
mound n - on a semiconductor wafer, an irregularly shaped projection on a semiconductor wafer surface with one or more irregularly developed facets. [ASTM F1241] Contrast pyramid. Also see haze.
mouse nip n - a semicircular intrusion into a straight edge of a film or etched pattern on a wafer or reticle. [SEMATECH] Also called mouse bite.