The electronic and photonic (e.g. laser diodes, LEDs, displays, etc.) industries face critical heat dissipation, thermal stress, weight and size problems. In the aerospace industry, this issue is called SWaP (size, weight and power). In response to the significant deficiencies of traditional thermal management materials, there are an increasing number of advanced materials. They have low coefficient of thermal expansions (CTEs), low-densities, and thermal conductivities up to 1700 W/m-K. Some are now low cost; others have the potential to be low cost in high-volume. They are being used in every packaging level, from module to enclosure. Production applications include numerous commercial and aerospace/defense electronic and photonic systems, including handsets, servers, laptops, cellular telephone base stations, electric and hybrid vehicles, power modules, high-power RF, phased array antennas, avionics, vetronics, telecommunications, laser diodes, LEDs, and displays, among many others. To illustrate the advantages, one IGBT manufacturer reports that replacing copper base plates with an advanced material eliminates solder joint failure (“The failure mechanism does not exist any longer”). Weight savings as high as 85% have been demonstrated. Advanced thermal materials are also being used to reduce surface temperatures of consumer products. Advanced Thermal Management and Packaging Materials is a 2-day course that covers the increasing number of advanced thermal management materials and provides an in-depth discussion of properties, manufacturing processes, applications, cost, lessons learned, typical development programs, and future directions. Traditional materials are discussed for reference. The focus is on materials used for heat spreaders, heat sinks, substrates, printed circuit boards (PCBs), enclosures/chassis, etc., but we also consider emerging advanced thermal interface materials (TIMs).
Participants are invited to bring their thermal management problems for discussion. This course is designed for every manager, engineer, and technician concerned with packaging materials, using semiconductor components, or supplying materials to the industry.
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At the end of this seminar, participants will be able to determine which materials will be best for a given application and will know how to test them, develop analytical models using them, and implement them in the product.
By using a combination of instruction by lecture, problem solving and question/answer sessions, participants will learn practical approaches to choosing the appropriate materials. From the very first moments of the seminar until the last sentence of the training, the driving instructional factor is application. Our instructors are internationally recognized experts in their fields and have years of experience (both current and relevant). The course notes offer hundreds of pages of reference material the participants can use back at their daily activities.
Dr. Carl Zweben, now an independent consultant, directed development and application of advanced thermal management and packaging materials for over 30 years. He was formerly Advanced Technology Manager and Division Fellow at GE Astro Space, where he directed the Composites Center of Excellence. His group developed and applied advanced thermal management materials and low-CTE printed circuit boards. It was the first to use Al/SiC, which is now well established in microelectronic and photonic packaging. Other affiliations have included Du Pont, where he worked on low-CTE aramid printed circuit board materials, Jet Propulsion Laboratory, the Georgia Institute of Technology National Science Foundation Packaging Research Center and Materials Sciences Corporation. Dr. Zweben was the first, and one of only two winners of both the GE One-in-a-Thousand and Engineer-of-the-Year awards. He is a Life Fellow of ASME, a Fellow of ASM and SAMPE, an Associate Fellow of AIAA, and has been a Distinguished Lecturer for AIAA and ASME. He has published and lectured widely on advanced thermal management and packaging materials, and has directed and presented over 250 short courses in North America, Europe and Asia.