Microelectromechanical Systems (MEMS) have captured the interest of the public with their promise to miniaturize existing systems. Although much of the excitement surrounding MEMS has died down, real applications are beginning to emerge. MEMS accelerometers for games, automotive, and wireless applications have emerged. MEMS inkjet chips are now ubiquitous, and new applications for RF and sensors are in development. One of the most challenging aspects of MEMS is packaging. Forces that normally do not affect meso-scale objects must be understood and controlled at the micro-scale. This has created a number of challenges related to the packaging of these components. MEMS Packaging is a 2-day course that offers detailed instruction on the design and modeling of MEMS packages. We place special emphasis on surface-to-volume ratio issues, electrostatics, liquid wetting, inertia, and other parameters. This course is a must for every manager, engineer, and technician working in semiconductor packaging, using MEMS components in high performance applications or new packaging configurations, or supplying packaging tools to the industry.
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Please note: If you or your company plan to pay by wire transfer, you will be charged a wire transfer fee of USD 45.00.
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By focusing on the fundamentals of MEMS packaging, participants will learn why advances in the industry are occurring along certain lines and not others. Our instructor works hard to explain MEMS packaging without delving heavily into the complex physics and materials science that normally accompany this discipline.
Participants learn basic but powerful aspects about semiconductor packaging. This skill-building series is divided into four segments:
Our courses are dynamic. We use a combination of instruction by lecture, problem solving, and question/answer sessions to give you the tools you need to excel. From the very first moments of the seminar until the last sentence of the training, the driving instructional factor is application. The course notes offer hundreds of pages of reference material that the participants can apply during their daily activities.
Our instructors are internationally recognized experts. Our instructors have years of current and relevant experience in their fields. They're focused on answering your questions and teaching you what you need to know.
Dr. Spangler received his Ph.D. in Electrical Engineering from The University of Michigan in 1988 after receiving his BSE(82) and MSE(84) also from Michigan. He is currently CTO and Vice President of Development at Treehouse Design, Inc. where he is responsible for leveraging electronic technologies to provide unique product solutions to a wide variety of customers. Dr. Spangler maintains a business, Advanced Microsystems, LLC, that provides consulting services to military, aerospace and medical customers for microsystem design, advanced packages and assembly processes.
Prior to joining Treehouse Design, Chip was the President and CTO of Aspen Technologies. By focusing on creating unique and effective solutions for customers using advanced semiconductor assembly technologies, he created engineering and manufacturing organizations that provided package solutions to customers. Through this effort he was able to help the company quadruple in size in just 8 years. Some of the most successful programs that he was responsible for at Aspen include very high performance IC packages for Agilent, ultra-miniature hermetic packages for medical applications, microfluidic devices for DNA analysis, packages for harsh environments including underwater and down-hole applications, as well as a wide range of optical MEMS devices including the key MEMS component for the world’s highest pixel count laser displays (>60 Meg pixels). Dr. Spangler and his partners sold Aspen Technologies in January of 2011.
Prior to working at Aspen Technologies, Chip was employed at Ford Microelectronics where he had responsibility for a wide range of microelectronic programs including analog ICs, pressure sensors, micro- machined fuel injectors, as well as airbag and chassis accelerometers. Many of these devices were qualified and manufactured in high volume. Dr. Spangler headed up the team that designed, engineered and qualified the world’s first plastic packaged MEMS airbag accelerometer.
Dr. Spangler is the author of over 30 technical publications and 10 patents. He is currently an Associate Editor for the IEEE Journal of Microelectromechanical Systems (JMEMS). He serves on the International Steering Committee for the IEEE Transducers Conference, and is a member of the Board of Directors of the Transducers Research Foundation. He has served on Technical Program Committees for the MEMS Conferences, SPIE Meetings, as well as other conferences. He was the General Chair for the 2008 Hilton Head Solid State Sensors, Actuators and Microsystems Workshop, and he was the Technical Program Chair for the 2006 Hilton Head Meeting. More recently he was the Local Arrangements Chair for the 2009 Transducers Conference, which was held in Denver, Colorado.