Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's chips contain hundreds of millions of transistors. These challenges have been accomplished because of the integrated circuit industry's ability to track Moore's Law. This has been accomplished by making devices smaller and smaller. However, the interconnect metals and associated dielectric materials that facilitate wiring between the transistors are severely limiting further performance improvements. Scientists and engineers are scrambling for materials that can allow performance improvements without sacrificing cost and reliability. Interconnect Process Integration is a 1-day course that offers detailed instruction on the materials, processing technologies, and integration necessary to create high performance interconnect systems. We place special emphasis on current issues related to designing and manufacturing of next-generation devices. This course is a must for every manager, engineer, and technician working in the semiconductor industry, using semiconductor components, or supplying tools to the industry.
By focusing on the fundamentals of interconnect performance, participants will learn why advances in the industry are occurring along certain lines and not others. Our instructors work hard to explain how interconnect systems work without delving heavily into the complex chemistry and materials science that normally accompany this discipline.
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Participants learn basic but powerful aspects about the semiconductor industry. This skill-building series is divided into three segments:
By using a combination of instruction by lecture, classroom exercises, and question/answer sessions, participants will learn practical information on semiconductor devices and the operation of this industry. From the very first moments of the seminar until the last sentence of the training, the driving instructional factor is application. Our instructors are internationally recognized experts in their fields and have years of both current and relevant experience.The course notes offer many pages of additional reference material the participants can use back at their daily activities.
Dr. Gambino received his B.S. degree in materials science from Cornell University, Ithaca, NY, in 1979, and his Ph.D. degree in materials science from the Massachusetts Institute of Technology, Cambridge, MA, in 1984. He joined IBM, Hopewell Junction, NY, in 1984, where he worked on silicide processes for Bipolar and CMOS devices. In 1992, he joined the DRAM development alliance at IBM's Advanced Semiconductor Technology Center, Hopewell Junction, NY. While there, he developed contact and interconnect processes for 0.25-, 0.175-, and 0.15-mm DRAM products. In 1999, he joined IBM's manufacturing organization in Essex Junction, VT, where he has worked on copper interconnect processes for CMOS logic technology. He has published over 90 technical papers and holds over 100 patents.