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Product Qualification Overview

Package reliability and qualification continue to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can also involve tradeoffs between performance and reliability; assessing the impact of new materials; dealing with limited margins, and other factors. In particular, the proliferation of new package types can create difficulties. This requires information on subjects like: statistics, testing, technology, processing, materials science, chemistry, and customer expectations. Customers expect fast, smooth qualification, but incorrect assumptions, use conditions, testing, calculations, and qualification procedures can severely impact this process. Your company needs competent engineers and scientists to help solve these problems. Product Qualification Overview is 1-day course that offers detailed instruction on a variety of subjects pertaining to semiconductor reliability and product qualification. This course is designed for every manager, engineer, and technician concerned with qualification in the semiconductor field, qualifying semiconductor components, or supplying tools to the industry.

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Additional Information

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Refund Policy

If a course is canceled, refunds are limited to course registration fees. Registration within 21 days of the course is subject to $100 surcharge.

What Will I Learn By Taking This Class?

Participants will learn to develop the skills to determine the best process for qualification; how to identify issues; and how to resolve them. This skill-building series is divided into four segments:

  1. Qualification Principles. Participants will learn how test structures can be designed to help test for a particular failure mechanism.
  2. JEDEC Qualification. Participants will learn how to perform a Joint Electron Device Engineering Council (JEDEC) Standard 47 Qualification. We will cover the overall procedure and introduce the individual tests. We will also discuss items related to requalification.
  3. AEC Q-100 Qualification. Participants will learn how to perform an Automotive Electronics Council (AEC) Q-100 Qualification. We will cover the overall procedure and introduce the individual tests. We will also discuss the important differences between the AEC Q-100 Qualification process and the JEDEC Qualification process.
  4. JEDEC Tests. Participants will learn about the JEDEC tests. We will cover the more important individual tests used in the qualification of semiconductor components. These tests are common to both the JEDEC and AEC standards.

Course Objectives

  1. The course will provide participants with an in-depth understanding of the failure mechanisms, equipment, and testing methods used to qualify today's components.
  2. Participants will be able to gather data, determine how best to plot the data and make inferences from that data.
  3. The course will identify major failure mechanisms; explain how they are observed, how they are modeled, and how they are handled in qualification.
  4. The course will discuss the major qualification processes, including JEDEC JESD47, AEC Q-100, and other related documents.
  5. Participants will be able to identify the steps and create a basic qualification process for semiconductor devices.
  6. Participants will be able to knowledgeably implement additional tests that are appropriate to assure the reliability of a component.
  7. Participants will be able to identify appropriate tools to purchase when starting or expanding a laboratory.

Webinar Outline

Day 1

  1. Overview of Qualification
    1. Basic Concepts
    2. Knowledge-based Qualification versus Standards-based Qualification
    3. Components of a Qualification Plan
  2. Statistics Concepts Used for Qualification
    1. Basic Statistics
    2. Distributions (Normal, Lognormal, Exponent, Weibull)
    3. The Poisson distribution
    4. Acceleration
    5. Number of Failures
  3. Overview of JEDEC JESD47
    1. Scope
    2. General Requirements
    3. Qualification and Requalification
    4. Qualification Tests
    5. Process and Product Changes
  4. Overview of AEC-Q100
    1. Scope
    2. General Requirements
    3. Qualification and Requalification
    4. Qualification Tests
    5. Qualification Families, Use of Generic Data
    6. Differences between JEDEC and AEC
  5. JEDEC Tests
    1. Preconditioning/Moisture Sensitivity Level Testing
    2. High Temperature Operating Life
    3. Autoclave
    4. Highly Accelerated Stress Test (HAST)
    5. Unibased HAST
    6. Temperature Humidity Bias Test
    7. Temperature Cycling
    8. Power Temperature Cycling
    9. High Temperature Storage Life Test
    10. Electrostatic Discharge (ESD) Human Body Model and Charged Device Model Testing
    11. Latch-Up Testing
    12. Board-Level Testing (Bend Test, Drop Test)
  6. Conclusions