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During a semiconductor product life cycle, there is a launch into high volume production test that provides sufficient test coverage to meet customer requirements, yet still meet cost targets. Design and test are closely linked, and there is a push to always implement test during the design process to determine what can be designed into the chip to fit seamlessly with test flows/outcomes. Products are typically guaranteed to meet performance in terms of design for testability, test coverage, and operational conditions such as voltage, frequency, and temperature. Test engineers must select automated test equipment (ATE), along with wafer probers, and packaged part handlers that can meet these requirements. There are many nuances to wafer probers and handlers depending on the wafer type and the package. There may be additional requirements associated with production test, such as accelerated life testing (burn-in), and system-level test (SLT). Many applications require testing across temperature and thermal management of dissipated power. All product lifecycles need to include continuous improvements to the point of diminishing return. For production testing, engineers primarily focus their efforts to improve test through test cost reduction and higher test coverage. Furthermore, production testing generates extremely high volumes of data, so the key is how to harvest this data and reduce it to meaningful information for action. Fundamentals of High-Volume Production Test is a 2-day course that offers engineers insight into the test development process, choosing automated test hardware, and the analysis of test data, to provide the engineer with key insights into the successful fielding of high-volume semiconductor components that work properly in the customers application with high levels of quality.
$1,295
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Please note: If you or your company plan to pay by wire transfer, you will be charged a wire transfer fee of USD 45.00.
Please email the printable registration form for public courses to us at the email address on the form to complete your order.
If you have any questions concerning this course, please contact us at info@semitracks.com.
If a course is canceled, refunds are limited to course registration fees. Registration within 21 days of the course is subject to $100 surcharge.
The course will cover the basic segments of today's high volume production test as found in Outsourced Assembly And Test contractors (OSATs), as well as internal Integrated Device Manufacturers (IDMs). Participants will learn basic, but powerful, aspects about the semiconductor industry. This skill-building series is divided into three segments:
Mark Berry is an independent consultant assisting startups in reducing the cost of test, implementing test strategies, accelerating new product introduction, and assisting test operations and business development. He also represents several test hardware, tester and test development firms. He has a deep understanding of high-volume semiconductor test.
His past roles have included process and device engineering roles at Motorola and Freescale. While at Motorola/Freescale, he was granted three device patents and authored several papers. He received the CEO Quality Award for radical improvements to FSRAM yield and reliability. This led to the Motorola's first perfect 100% yielding wafer. He led large product and test operation teams across a wide spectrum of chips used in cellular phone applications - leading to 25 transceiver product qualifications across 7 technologies. His efforts helped to improve gross margins by 20%. Specifically, in the RF Power Amplifier module area, his efforts helped achieve a 60% cost reduction in 6 months. He is adept at taking products through concept, selection, definition, planning, execution, validation & ramp. Mark also sponsored a number of rotational engineers and enjoys teaching & mentoring.
He has also held executive leadership roles during his 14-year tenure at Amkor, leading worldwide test development across three sites. He maintained and implemented Amkor's test equipment roadmap and regional test business development activities. He led global teams to implement complex advanced packaging flows (2.0/2.5/3D technologies) and devise optimum test flows for them. Finally, he worked at UTAC, leading their US business development team. He is familiar with a broad range of ATE & SLT testers, many types of handlers and probers, as well as contacting via probe cards and a wide variety of socket technology.
Mark has an MBA from St Edward's University and a BSEE from the University of Illinois at Urbana-Champaign.