Package reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms and determining their impact on the reliability of the circuit. Today, reliability can also involve tradeoffs between performance and reliability, assessing the impact of new materials, dealing with limited margins, etc. In particular, the proliferation of new package types can create difficulties. This requires information on subjects like: statistics, testing, technology, processing, materials science, chemistry, and customer expectations. Customers expect fast, smooth qualification, but incorrect assumptions, use conditions, testing, calculations, and qualification procedures can severely impact this process. Your company needs competent engineers and scientists to help solve these problems. Product Qualification is an 8-hour webinar that offers detailed instruction on a variety of subjects pertaining to semiconductor reliability and product qualification. This course is designed for every manager, engineer, and technician concerned with qualification in the semiconductor field, qualifying semiconductor components, or supplying tools to the industry.
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Registrants learn to develop the skills to determine the best process for qualification, how to identify issues and how to resolve them.