This webinar will provide an overview of x-ray radiography and its uses for semiconductor and electronics failure analysis. X-ray radiography is a non-destructive technique that can help localize defects and provide quality control to manufacturing/assembly processes. We will discuss how the technique works, the basic equipment for performing the technique, and more importantly, how to interpret the images. Image interpretation is the biggest challenge with x-ray radiography, so we will delve into the issues associated with image formation, package materials and structure, and how to examine data. This webinar is a must for failure analysis engineers and technicians, reliability engineers, quality control engineers, and product engineers who read reports with this data.
Add To Shopping Cart
Please note: If you or your company plan to pay by wire transfer, you will be charged a wire transfer fee of USD 45.00.
Please email the printable registration form for public courses to us at the email address on the form to complete your order.
If you have any questions concerning this course, please contact us at firstname.lastname@example.org.
If a course is canceled, refunds are limited to course registration fees. Registration within 21 days of the course is subject to $100 surcharge.