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This webinar will provide an overview of x-ray radiography and its uses for semiconductor and electronics failure analysis. X-ray radiography is a non-destructive technique that can help localize defects and provide quality control to manufacturing/assembly processes. We will discuss how the technique works, the basic equipment for performing the technique, and more importantly, how to interpret the images. Image interpretation is the biggest challenge with x-ray radiography, so we will delve into the issues associated with image formation, package materials and structure, and how to examine data. This webinar is a must for failure analysis engineers and technicians, reliability engineers, quality control engineers, and product engineers who read reports with this data.
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Please note: If you or your company plan to pay by wire transfer, you will be charged a wire transfer fee of USD 45.00.
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