System Maintenance occurs every Friday.

Solder Joint Analysis (Online Version)

Solder Joint Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex circuit boards. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of disciplines in order to effectively perform solder joint analysis. This requires knowledge of subjects like: design, testing, technology, processing, materials science, and chemistry. Failed boards and low yields can lead to customer returns and idle manufacturing lines that can cost a company millions of dollars a day. Your industry needs competent analysts to help solve these problems. Solder Joint Analysis is a 1-day course that offers detailed instruction on a variety of effective tools, as well as the overall process flow for locating and characterizing the defects responsible for the failure. This course is designed for every manager, engineer, and technician working in the electronics field, using electronic components or supplying tools to the industry.

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What Will I Learn By Taking This Class?

Participants learn to develop the skills to determine what tools and techniques should be applied, and when they should be applied. This skill-building series is divided into three segments:

  1. The Structure of a Solder Joint. Participants learn about the materials and processing techniques for solder joining. This includes not only the solder joint materials, but also the finishes on the chips and the boards that aid in the joining process.
  2. The Tools and Techniques. Participants learn the strengths and weaknesses of a variety of tools used for analysis, including fault isolation techniques, materials characterization tools, package analysis tools, sample preparation, and surface science tools.
  3. Case Histories. Participants identify how to use their knowledge through the case histories. They learn to identify key pieces of information that allow them to determine the possible cause of failure and how to proceed.

Course Objectives

  1. The seminar will provide participants with an in-depth understanding of the tools, techniques and processes used in solder joint analysis.
  2. Participants will be able to determine how to proceed with a submitted request for analysis, ensuring that the analysis is done with the greatest probability of success.
  3. The seminar will identify the advantages and disadvantages of a wide variety of tools and techniques that are used for solder joint characterization.
  4. The seminar offers several video demonstrations of analysis techniques, so the analyst can get an understanding of the types of results they might expect to see with their equipment.
  5. Participants will be able to identify basic technology features on electronic components and boards.
  6. Participants will be able to identify a variety of different failure mechanisms and how they manifest themselves.
  7. Participants will be able to identify appropriate tools to purchase when starting or expanding a laboratory.

Course Outline

Solder Joint Basics


  1. Solder Joint Basics
  2. Solder Joints - Materials and Processing
  3. Solder Joint Fluxes and Underfills
  4. Solder Joint Failure Mechanisms
  5. Quiz: Solder Joints Basics


  1. Solder Joint Failure Mechanisms
  2. Solder Joint Basics

Quality Analysis Techniques


  1. Optical and SEM Analysis Techniques
  2. Non Destructive Analysis Techniques
  3. Structural Analysis Techniques
  4. Contamination Analysis Techniques
  5. Quiz: Quality Analysis Techniques


  1. Optical and SEM Analysis Techniques

Processing Problems and Troubleshooting Techniques


  1. Cracking and Warpage Problems
  2. Solder Wetting Problems and Troubleshooting Techniques
  3. Quiz: Processing Problems and Troubleshooting Techniques

Contamination and Cleanliness


  1. Contamination and Cleanliness
  2. Electrochemical Migration Primer
  3. ECM Testing and Examples
  4. Introduction to Cleanliness
  5. Quiz: Contamination and Cleanliness


  1. Contamination and Cleanliness

Solder Joint Reliability Testing


  1. Board Level Reliability
  2. Quiz: Solder Joint Reliability Testing


  1. Board Level Reliability