System Maintenance occurs every Friday.

Introduction to Processing (Online Version)

Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today’s wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Introduction to Processing is an online course that offers an overview look into the semiconductor manufacturing process, and the individual processing technologies required to make them. We place special emphasis on the basics surrounding each technique, and we summarize the current issues related to manufacturing the next generation devices. This course is a must for every manager, engineer and technician working in the semiconductor industry, using semiconductor components or supplying tools to the industry.

Register for an Account


1-Year Online Training Subscription

(Includes this and other materials.)



Pay Via Credit Card

Add To Shopping Cart

Pay Via Purchase Order/Check

Please email the printable registration form for online training to us at the email address on the form to complete your order.

Additional Information

Refund Policy

Interested in a version of this course where you can ask questions in real time? Public and In-House versions of this course are available!

What Will I Learn By Taking This Course?

Registrants learn basic but powerful aspects about the semiconductor industry. This skill-building series is divided into four segments:

  1. Basic Processing Steps. Each processing step addresses a specific need in IC creation. Registrants learn the fundamentals of each processing step and why they are used in the industry today.
  2. The Evolution of Each Processing Step. It is important to understand how wafer fab processing and packaging/assembly came to the point where they are today. Registrants learn how each technique has evolved for use in previous and current generation ICs.
  3. Current Issues in Wafer Fab Processing. Registrants learn how many processing steps are increasingly constrained by physics and materials science. They also learn about the impact of using new materials in the fabrication process and how those materials may create problems for the manufacturers in the future.
  4. Current Issues in Assembly and Packaging. Registrants learn how packaging is a key enabler for semiconductor components. They also learn why we are seeing an explosion of different packaging types.

Course Objectives

  1. This course will provide participants with an overview of the semiconductor industry and its technical issues.
  2. Registrants will understand the basic concepts behind the fundamental wafer fab processing steps.
  3. Registrants will understand the basic concepts behind basic assembly and packaging steps.
  4. This course will identify the key issues related to each of the processing techniques and their impact on the continued scaling of the semiconductor industry.
  5. Registrants will be able to identify the basic features and principles associated with each major processing step. These include processes like chemical vapor deposition, ion implantation, lithography, and etching.
  6. Registrants will understand how processing, reliability, power consumption and device performance are interrelated.
  7. Registrants will be able to understand processing steps for CMOS, BiCMOS, and bipolar technologies.
  8. This course will provide an introduction to the packaging process and discuss the fundamental drivers behind the current developments in packaging.

Course Outline

Assembly and Packaging


  1. Assembly and Packaging Processes Introduction
  2. Package Types
  3. Package Design Principles
  4. Dicing
  5. Leadframes
  6. Lead Finish and Trim - Solder Ball Attach
  7. Wire Bonding
  8. Die Attach
  9. Transfer Molding
  10. Bump Processes
  11. Substrates
  12. Underfills
  13. Singulation


  1. Packaging Overview Video

Wafer Fab Processing


  1. Starting Material - Bulk Silicon Process
  2. Wafer Specifications and Defects
  3. Epitaxial Growth Process
  4. Deposition
  5. Oxidation
  6. Diffusion
  7. Ion Implantation
  8. Dry Etching Processes
  9. Wet Etching Processes
  10. Chemical Mechanical Planarization
  11. Lithography - Introduction
  12. Lithography - Resolution
  13. Lithography - Resists
  14. Lithography - Subwavelength Issues
  15. LOCOS and STI
  16. Salicide and BEOL


  1. Lithography - Introduction


  1. Chip Fabrication Process
  2. Micronas Wafer Fab