Solder Joint Analysis

This course covers solder joints and the analysis of problems that pertain to them. We primarily focus on the solder joints between the component and the board, rather than solder joints internal to a component, but many of the concepts will apply to both. We cover solder joint basics, quality analysis techniques, processing problems and troubleshooting techniques, contamination and cleanliness, and reliability testing methods.

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1-Year Online Training Subscription
(Includes this and other materials.)

Cost

$500

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Please fax the printable registration form for online training to us at 1-866-205-0713 to complete your order.

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Solder Joint Basics

This section covers the fundamentals of solder joints. We discuss the basic physical process that occurs when one creates a solder joint, including the formation of the intermetallic layer that serves as the interface. We discuss the various fluxes and underfills that engineers use in conjuction with solder joints. We also discuss the various major mechanisms associated with solder joint failure.

Presentations

Solder Joint Basics

Solder Joints - Materials and Processing

Solder Joint Fluxes and Underfills

Solder Joint Failure Mechanisms

Quiz: Solder Joints Basics

Documents

Solder Joint Failure Mechanisms

Solder Joint Basics

Videos

NONE

Quality Analysis Techniques

This section covers a variety of quality analysis techniques used to assess solder joints. This section is broken down into four groups: optical and scanning electron microscope inspection techniques, non-destructive analysis techniques like x-ray radiography, contamination analysis techniques, and structural analysis techniques like shear testing.

Presentations

Optical and SEM Analysis Techniques

Non Destructive Analysis Techniques

Structural Analysis Techniques

Contamination Analysis Techniques

Quiz: Quality Analysis Techniques

Documents

Optical and SEM Analysis Techniques

Videos

NONE

Processing Problems and Troubleshooting Techniques

This section covers the major processing problems as well as the techniques used to troubleshoot those problems. This includes solder wetting problems like head-in-pillow, voiding, pad cratering, and others. This section also includes cracking problems like creep and fatigue.

Presentations

Cracking and Warpage Problems

Solder Wetting Problems and Troubleshooting Techniques

Quiz: Processing Problems and Troubleshooting Techniques

Documents

NONE

Videos

NONE

Contamination and Cleanliness

This section covers the topic of contamination and cleanliness. We discuss the main contamination types: the conductive anodic filament, creep corrosion, and dendritic growth. We discuss sources of contamination, like flux residues such as weak organic acids, and the environment, We also discuss techniques to identify contamination levels like ion chromotography, the Foresite C3 system, and the Omegameter.

Presentations

Contamination and Cleanliness

Electrochemical Migration Primer

ECM Testing and Examples

Introduction to Cleanliness

Quiz: Contamination and Cleanliness

Documents

Contamination and Cleanliness

Videos

NONE

Solder Joint Reliability Testing

This section covers the topic of reliability testing. These tests are accelerated tests to create failures quickly to allow the engineer to assess the overall reliability of the solder joint and develop failure models. We discuss solder joint stress tests such as temperature cycling, the bend test, the drop test, vibration testing, humidity testing, and more.

Presentations

Board Level Reliability

Quiz: Solder Joint Reliability Testing

Documents

Board Level Reliability

Videos

NONE