2005 December Newsletter

Volume 1, Issue 8

December 2005

Welcome to the Semitracks Online Monthly Newsletter! It is our goal that you find this newsletter interesting, informative and useful. Please email any comments or feedback to This email address is being protected from spambots. You need JavaScript enabled to view it. .

1. ESD/Latchup Design and Technology Course

Presenter - Dr. Steven Voldman

January 18-19 at the Embassy Suites – Tempe, AZ

Semitracks brings you yet another opportunity to learn from the experts - an intensive two-day course on ESD and Latchup Design and Technology. Dr. Steven Voldman will cover the design, layout, and technology elements required to minimize the effects of electrostatic discharge and CMOS latchup with today's advanced semiconductor devices. Dr. Voldman will address a variety of technologies including CMOS, BiCMOS and compound semiconductors. The course will be held at the Embassy Suites in Tempe, Arizona from Wednesday, January 18 through Thursday January 19. The course will run from 8 AM to 5 PM with an hour lunch break each day.

As a special incentive, attendees can purchase copies of Dr. Voldman’s books, ESD: Physics and Devices, and ESD: Devices and Circuits, at a special discounted rate. To register for this event, click here.

2. Upcoming Conferences

International Reliability Physics Symposium

March 26-30, 2006 San Jose McEnery Convention Center in San Jose, CA

To view the IRPS website, click here.

Semicon West 2006

July 10-14, 2006 Moscone Center in San Francisco, CA

For more information, click here.

3. Course Schedule

Invest in yourself and your staff. Time is running short to enroll in our Winter courses on Thermal Management, Packing Technology, Packaging Design, and ESD. Come and learn from the experts!

Thermal Management

As new, more powerful chip designs are introduced, they consume more power. This has made thermal management an important concern in today's high performance systems. Systems ranging from active electronically scanned radar arrays to web servers require components that can dissipate heat efficiently.

Thermal Management (January 20, 2006) - Tempe, AZ

Packaging Technology

This course will provide an overview of the current business climate, anticipated trends and the associated impact on assembly/packaging roadmaps. There will be an in depth discussion of both high-end CPU roadmaps plus the roadmaps to address the multitude of communications and network devices that are driving the digital revolution. The course will generically address typical assembly flows and cost implications for both wafer fabrication and assembly with special focus on what the low cost alternatives will be in both camps.

Packaging Technology (January 23-24, 2006) - Tempe, AZ

Packaging Design

This course provides an overview of the packaging design process. The course covers current packaging technologies, including chip scale packaging, Ball Grid Array technology and other current concepts. This class focuses on techniques and the importance of thermal and mechanical simulations. Discussions and examples will concentrate on thermal performance simulations, assembly & packaging stresses, package reliability (including solder joint fatigue simulation), and interactions between chip and package. In addition, a special section will be examples of successful wafer level simulations.

Packaging Design (January 25-27) - Tempe, AZ

Failure and Yield Analysis

Are you new to failure analysis? Does your position require you to have an understanding of failure analysis? Learn about the latest techniques for analyzing complex devices. We have the most comprehensive short course in the industry covering failure analysis. We cover all the techniques from the simple ones (such as Liquid Crystal) all the way to complex ones (such as PICA and Laser Voltage Probing). Learn the secrets of analyzing a component right every time.

Failure and Yield Analysis (April 24-27, 2006) – Austin, TX

Failure and Yield Analysis (May 15-18, 2006) – Munich, Germany

Reliability

Reliability is a critical element to the success of any semiconductor product. Reliability margins are increasingly squeezed by today’s deep submicron technologies. Learn about the major reliability failure mechanisms, test structures, and test equipment. Learn how to optimize reliability, performance, and cost.

Semiconductor Reliability (May 10-12, 2006) – Munich, Germany

To register for our courses, register online or download the registration form. Fax completed form to Semitracks at (505) 858-9813, or call (505) 858-0454 to register by phone.

We offer other courses as well as in-house courses. For more information, visit our website at http://www.semitracks.com.

4. Semitracks Segment of the Month

Semitracks’ new and improved online training is convenient, up-to-date, and cost effective. Access the same material presented in our courses whenever you need it, right when you need it without having to worry about the high costs and hassle of traveling. The semiconductor field is an ever-changing one. With access to the most current information, you can stay on top of the new technology. Online training is also very cost effective. For only $500 per year, you gain access to thousands of dollars worth of courses and course material.

Give our online training a try – for free. This month’s topic is Secondary Ion Mass Spectroscopy (SIMS). SIMS is a surface analysis technique that can provide information on dopant concentrations, contamination, and other issues. To learn more, click here.

Sign up to access all of Semitracks online training at http://www.semitracks.com/default.htm and “Learn from the Experts” when it’s convenient for you.

5. Technical Tidbits

Junction Breakdown in Advanced Devices

As device sizes become smaller and smaller one must pay more attention to the radius of curvature of the junctions and implants. This graph shows the breakdown voltage of a junction as a function of impurity concentration on the lightly doped side and the junction radius. Notice that as the junction radius decreases, the breakdown voltage decreases as well. A very tight spherical corner can have a breakdown voltage several orders of magnitude below that of a plane or a large junction corner. This can observed using light emission microscopy. Light from avalanche breakdown occurs that the corners of the junctions first, since the electric field is the highest there. Next, it occurs along the cylindrical edges of the junction. Finally, the bottom plane of the junction will light up.

6. Our Mission

Education and Training for the Electronics Industry

Semitracks provides education, training, and certification services and products for the electronics industry. We specialize in serving Semiconductor, Microsystems and Nanotechnology suppliers and users. Semitracks Inc. helps engineers, technicians, scientists, and management understand these dynamic fields. We offer courses in Semiconductor Reliability, Test, Packaging, Process Integration, Failure and Yield Analysis, and Focused Ion Beam technology. Learn from the Experts.