Laser Cutting Figures

Diagram of a Xenon laser system. (Courtesy Florod Corp.).




Photograph shows a metal line before being cut by a Xenon laser system. (Photo courtesy Sandia Labs).




Photograph shows a metal line after being cut by a Xenon laser system. (Photo courtesy Sandia Labs).




Photograph shows a 50 x 50 mm cut made in polyimide using about 50 shots of very low power (< 15% of maximum) using a 50x near UV objective lens . (Courtesy New Wave Research).




Photograph shows a 100 x 200 mm cut made in polyimide using a 50 x 50 mm aperature scanned across the die while the laser was in a pulse cutting mode (355 nm, < 15% max. power, 20 Hz, 50x near UV objective lens). (Courtesy New Wave Research).




Photograph shows a 50 x 50 mm area of polyimide removed, SiO2 removed from 3 aluminum lines and the top aluminum line cut. This was performed using approximately 50 shots of low UV energy with a 50x near UV objective followed by four single shots of a 532 nm laser at approximately 40% power using a 100x objective, followed by a single shot of the 532 nm laser to cut the aluminum line. (Courtesy New Wave Research).




Photograph shows a 50 x 50 mm area of polyimide removed and a 20 x 20 mm area of metal 3 (aluminum) removed to expose metal 2 and metal 1 below. This was performed using about 50 shots from the 355 nm laser at low energy followed by two shots from the 532 nm laser at 50% power to open metal 3. (Courtesy New Wave Research).




Photograph shows a basic pulsed Nd:YAG (frequency doubled and tripled) laser cutting system. (Courtesy New Wave Research).