System Maintenance occurs every Friday.

Die Attach

Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: electrical connections to the customer’s printed circuit board or module; protection from the environment; heat transfer; and providing a format for handling.  Numerous critical technologies have been developed to create these packages; technologies that continue to advance with each new requirement for cost reduction, space savings, higher speed electrical performance, finer pitch, die surface fragility, new reliability requirements, and new applications. One of these technologies is die attach.  Die Attach is an 8-hour course that covers the materials, processes, and process flows for attaching a semiconductor die to a substrate.

By focusing on current issues with die attach technology, participants will learn why advances in the industry are occurring along certain lines and not others. Participants will learn about this particular aspect of semiconductor packaging without having to delve heavily into the complex physics and materials science that normally accompany this discipline.

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Item

1-Year Online Training Subscription

(Includes this and other materials.)

Cost

$700

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Please email the printable registration form for online training to us at the email address on the form to complete your order.

Additional Information

Refund Policy

What Will I Learn By Taking This Class?

Participants will learn basic, but powerful aspects of die attach. This skill-building series is divided into three segments:

  1. Die Attach Basics. Participants will learn the fundamentals of the die attach process, including the materials and the equipment used for the process.
  2. Die Attach Process Concepts. Participants will learn about the die attach cycle, the critical parameters and process requirements, as well as important quality indicators.
  3. Die Attach Controls and Monitors. Participants will learn about defect criteria associated with the die attach process, as well as methods to control and monitor the process.

Course Objectives

  1. This course will provide participants with an understanding of the fundamentals of the die attach process.
  2. Participants will become familiar with die attach tools and materials.
  3. Participants will understand what types of products and packages use die attach.
  4. Participants will be able to explain the die attach process.
  5. Participants will become familiar with die attach specifications and parameters, and will be able to determine the basic process requirements.
  6. Participants will be introduced to quality indicators associated with the die attach process.
  7.  Participants will be able to identify and distinguish different defects that might arise from the die attach process.
  8. Participants will be introduced to alternative die attach processes, like eutectic die attach materials, die attach films, and cured 2-stage polymer die attach liquids.

Course Contents

Die Attach

  • Announcements

Presentations

  • Die Attach Basics
  • Die Attach Overview
  • Equipment and Accessories
  • Process
  • Defect Criteria
  • Process Controls and Monitors
  • Eutectic Die Attach

Final Test

Certificate

  • Die Attach - Certificate of Completion

Videos