System Maintenance occurs every Friday.
System Maintenance occurs every Friday.
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today’s microprocessor, graphics, and AI processing chips have one thousand times the processing power of those a decade ago. These challenges have been accomplished because of the integrated circuit industry’s ability to track something known as Moore’s Law. Moore’s Law states that an integrated circuit’s processing power will double every two years. This has been accomplished by making devices smaller and smaller. The question looming in everyone’s mind is “How far into the future can this continue?” Leading Edge Process Tradeoffs is an 8 hour course that offers detailed instruction on the fabrication process used in a modern integrated circuit, and the tradeoffs engineers and scientists must make in order to reliably manufacture state-of-the-art integrated circuits. We place special emphasis on current issues related to manufacturing the next generation devices. This course is a must for every manager, engineer and technician working in the semiconductor industry, using semiconductor components or supplying tools to the industry.
By concentrating on the latest developments in silicon integrated circuit technology, participants will learn why tradeoffs are becoming critical at feature sizes below 20nm. Our instructors work hard to explain semiconductor processing without delving heavily into the complex physics and materials science that normally accompany this discipline.
$700
Please email the printable registration form for online training to us at the email address on the form to complete your order.
Participants will learn basic, but powerful, aspects about integrated circuit fabrication technology. They will focus on understanding impacts on performance, understanding basics of what may happen if something is incorrect or pushing a design limit, and knowing what to consider and ask for when working with process engineers on issues and improvements. This skill-building series is divided into three segments: