System Maintenance occurs every Friday.

Reliability

  1. The seminar will provide participants with an in-depth understanding of the failure mechanisms, test structures, equipment and testing methods used to achieve today's high reliability components.
  2. The participant will be able to gather data and determine how best to plot the data and make inferences from that data.
  3. The seminar will identify the major failure mechanisms, explain how they are observed, how they are modeled and how they are eliminated. There will be a particular emphasis on electromogration and package level failure mechanisms.
  4. The seminar offers a variety of video demonstration of analysis techniques, so that the analyst can get an understanding of the types of results they might expect to see with their equipment.
  5. The participant will be able to identify basic test structures and how they are used to help quantify reliability on Semiconductor devices.
  6. The participant will be able to knowledgeably implement screens that are appropriate to assure the reliability of a component.
  7. The participant will be able to identify appropriate tools to purchase when starting or expanding a laboratory.
  8. In this course, we will concentrate in particular on electromigration. The customer has identified electromigration as a particular concern and area where they need additional knowledge.

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Item

1-Year Online Training Subscription

(Includes this and other materials.)

Cost

$700

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Please email the printable registration form for online training to us at the email address on the form to complete your order.

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What Will I Learn By Taking This Class?

Course Objectives

Course Contents

Reliability

  • Announcements
  • 4-Day Reliability Course Forum

Module 1 - Reliability Introduction, Statistics and Distributions & More

  • Introduction to Semiconductor Reliability
  • Acceleration and Number of Failures
  • Plotting Data
  • Reliability Distribution Types
  • Basic Reliability Statistics
  • Which Distribution Should I Use?
  • Accelerated Testing Statistics
  • Populations and Sample Sizes

Module 2 - Die-Level Failure Mechanisms

  • Time Dependent Dielectric Breakdown Overview
  • Hot Carrier Degradation - Overview
  • Electromigration
  • Stress Induced Voiding - Case History
  • Stress Induced Voiding

Module 3 - Package-Level and Use Condition Failure Mechanisms

  • Ionic Contamination
  • Moisture and Corrosion
  • Thermomechanical Stress - Part 1
  • Thermomechanical Stress - Part 2
  • Thermal Degradation
  • Electrical Overstress and ESD
  • Radiation Effects

Module 4 - Testing Aspects of Semiconductor Reliability

  • Test Structures - Basics
  • Reliability Test Structures
  • Self Stressing Test Structures
  • Reliability Test Equipment - Wafer Level
  • Reliability Test Equipment - Probes
  • Reliability Test Equipment - Packaged Parts
  • Developing Electrical Screens

Final Test

  • Semiconductor Reliability – Final Test

Certificate

  • 4-Day Reliability Course (Online Version) Certificate

Documents

  • Reliability Distributions
  • Reliability Distribution Examples
  • Accelerated Testing Statistics
  • Populations and Sample Sizes
  • Electromigration
  • Stress Induced Voiding - Introduction
  • Ionic Contamination
  • Thermomechanical Stress - Part 1
  • Thermomechanical Stress - Part 2
  • Thermal Degradation
  • Developing Electrical Screens
  • Reliability Test Structures
  • Self Stressing Test Structures
  • Test Structures - Basics
  • Reliability Test Equipment: Wafer Level
  • Reliability Test Equipment: Probes