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Semiconductor Reliability and Product Qualification

Product reliability and qualification continues to evolve with the electronics industry.  New electronics applications require new approaches to reliability and qualification.  In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability; assessing the impact of new materials; dealing with limited margins, and other factors.  This requires information on subjects like: statistics, testing, technology, processing, materials science, chemistry, and customer expectations. While customers expect high reliability levels, incorrect testing, calculations, and qualification procedures can severely impact reliability.  Semiconductor Reliability and Product Qualification is a 32 hour course that offers detailed instruction on a variety of subjects pertaining to semiconductor reliability and qualification. This course is designed for every manager, engineer, and technician concerned with reliability in the semiconductor field, qualifying semiconductor components, or supplying tools to the industry.

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1-Year Online Training Subscription

(Includes this and other materials.)

Cost

$700

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Please email the printable registration form for online training to us at the email address on the form to complete your order.

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What Will I Learn By Taking This Class?

Participants will learn to develop the skills to determine what failure mechanisms might occur, and how to test for them, develop models for them, and eliminate them from the product.  This skill building series is divided into four segments:

  1. Overview of Reliability and Statistics. Participants will learn the fundamentals of statistics, sample sizes, distributions and their parameters.
  1. Failure Mechanisms. Participants will learn the nature and manifestation of a variety of failure mechanisms that can occur both at the die and at the package level. These include: time-dependent dielectric breakdown, hot carrier degradation, electromigration, stress-induced voiding, moisture, corrosion, contamination, thermomechanical effects, interfacial fatigue, and others.
  1. Qualification Principles. Participants will learn how test structures can be designed to help test for a particular failure mechanism.
  1. Test Strategies. Participants will learn about the JEDEC test standards, how to design screening tests, and how to perform burn-in testing effectively.

Course Objectives

  1. This course will provide participants with an in-depth understanding of the failure mechanisms, test structures, equipment, and testing methods used to achieve today’s high reliability components.
  2. Participants will be able to gather data, determine how best to plot the data and make inferences from that data.
  3. This course will identify the major failure mechanisms, explain how they are observed, how they are modeled, and how they are eliminated.
  4. This course will offer a variety of video demonstrations of analysis techniques, so the participants can get an understanding of the types of results they might expect to see with their equipment.
  5. Participants will be able to identify the steps and create a basic qualification process for semiconductor devices.
  6. Participants will be able to knowledgeably implement screens that are appropriate to assure the reliability of a component.
  7. Participants will be able to identify appropriate tools to purchase when starting or expanding a laboratory.

Course Contents

Semiconductor Reliability and Product Qualification

  • Announcements

Reliability Fundamentals

  • Introduction to Semiconductor Reliability
  • Plotting Data
  • Reliability Distribution Types
  • Basic Reliability Statistics
  • Which Distribution Should I Use?
  • Acceleration and Number of Failures
  • Accelerated Testing Statistics
  • Populations and Sample Sizes

Die and Package Reliability

  • Time Dependent Dielectric Breakdown Overview
  • Hot Carrier Degradation - Overview
  • Electromigration
  • Stress Induced Voiding - Case History
  • Stress Induced Voiding
  • Ionic Contamination
  • Moisture and Corrosion
  • Thermomechanical Stress - Part 1
  • Thermomechanical Stress - Part 2
  • Thermal Degradation

Chip Attach and System Reliability

  • Through Silicon Vias
  • Board Level Reliability
  • Solder Joint Failure Mechanisms
  • Electrical Overstress and ESD
  • Radiation Effects

Qualification Testing

  • Test Structures - Basics
  • Reliability Test Structures
  • Self Stressing Test Structures
  • Reliability Test Equipment - Wafer Level
  • Reliability Test Equipment - Probes
  • Reliability Test Equipment - Packaged Parts
  • Developing Electrical Screens
  • Developing Stress Tests and Life Tests
  • Product Qualification Overview
  • MIL STD Qualification
  • Failure Mechanism Driven Qualification
  • Stress Driven Qualification
  • AEC Q100 Qualification
  • Knowledge Based Qualification
  • JEDEC Tests - Part 1
  • JEDEC Tests - Part 2
  • JEDEC Tests - Part 3
  • Basic Logical Operators and Boolean Algebra

Final Test

  • Final Test - Semiconductor Reliability and Product Qualification

Certificate

  • Semiconductor Reliability and Product Qualification Certificate

Documents

  • Board Level Reliability
  • Solder Joint Failure Mechanisms
  • Electromigration
  • Stress Induced Voiding - Introduction
  • Ionic Contamination
  • Thermomechanical Stress - Part 1
  • Thermomechanical Stress - Part 2
  • Thermal Degradation
  • Screens, Stress Tests, and Life Tests
  • Developing Electrical Screens
  • Developing Stress Tests and Life Tests
  • JEDEC Tests - Part 1
  • JEDEC Tests - Part 2
  • JEDEC Tests - Part 3
  • Reliability Test Structures
  • Self Stressing Test Structures
  • Test Structures - Basics
  • Reliability Test Equipment: Wafer Level
  • Reliability Test Equipment: Probes
  • Reliability Distributions
  • Reliability Distribution Examples
  • Accelerated Testing Statistics
  • Populations and Sample Sizes

Videos

  • Bond Shear
  • Wire Pull Test