System Maintenance occurs every Friday.

Semiconductor Technology Overview

Semiconductor and integrated circuit development continues to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today’s wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Semiconductor Technology Overview is a 32 hour course that offers an overview look into the semiconductor manufacturing process, and the individual processing technologies required to make them. We place special emphasis on the basics surrounding each technique, and we summarize the current issues related to manufacturing the next generation devices. This course is a must for every manager, engineer and technician working in the semiconductor industry, using semiconductor components, or supplying tools to the industry.

Register for an Account

Item

1-Year Online Training Subscription

(Includes this and other materials.)

Cost

$700

Pay Via Credit Card

Add To Shopping Cart

Pay Via Purchase Order/Check

Please email the printable registration form for online training to us at the email address on the form to complete your order.

Additional Information

Refund Policy

What Will I Learn By Taking This Class?

By focusing on the basics of each processing step and the issues surrounding them, participants will learn why certain techniques are preferred over others. Our instructors work hard to explain how semiconductor processing works without delving heavily into the complex physics and mathematical expressions that normally accompany this discipline.  Participants will learn basic but powerful aspects about the semiconductor industry. This skill-building series is divided into four segments:

  1. Basic Processing Steps. Each processing step addresses a specific need in IC creation. Participants will learn the fundamentals of each processing step and why they are used in the industry today.
  1. The Evolution of Each Processing Step. It is important to understand how wafer fab processing came to the point where it is today. Participants will learn how each technique has evolved for use in previous and current generation ICs.
  1. Current Issues in Wafer Fab Processing. Participants will learn how a number of the processing steps are increasingly constrained by physics and materials science. They will also learn about the impact of using new materials in the fabrication process, and how those materials may create problems for the manufacturers in the future.
  1. Current Issues in Assembly and Packaging. Participants will learn how packaging is a key enabler for semiconductor components. They will also learn why we are seeing an explosion of different packaging types.

Course Objectives

  1. This course will provide an overview of the semiconductor industry and its technical issues.
  2. Participants will understand the basic concepts behind the fundamental wafer fab processing steps.
  3. This course will identify the key issues related to each of the processing techniques and their impact on the continued scaling of the semiconductor industry.
  4. Participants will be able to identify the basic features and principles associated with each major processing step. These include processes like chemical vapor deposition, ion implantation, lithography, and etching.
  5. Participants will understand how processing, reliability, power consumption, and device performance are interrelated.
  6. Participants will gain an understanding of the testing process, and how testing impacts quality and the cost of the product.
  7. This course will provide an introduction to the packaging process, and discuss the fundamental drivers behind the current developments in packaging.

Course Contents

Semiconductor Technology Overview

  • Announcements

Processing

  • Starting Material - Bulk Silicon Process
  • Wafer Specifications and Defects
  • Silicon on Insulator Process
  • Epitaxial Growth Process
  • Deposition
  • Oxidation
  • Diffusion
  • Ion Implantation
  • Dry Etching Processes
  • Wet Etching Processes
  • Chemical Mechanical Planarization
  • Lithography - Introduction
  • Lithography - Resolution
  • Lithography - Resists
  • Lithography - Subwavelength Issues
  • Lithography - Future
  • LOCOS and STI
  • Salicide and BEOL
  • Quiz: Wafer Fab Processing

Packaging

  • Assembly and Packaging Processes Introduction
  • Package Types
  • Package Design Principles
  • Dicing
  • Leadframes
  • Wire Bonding
  • Lead Finish and Trim - Solder Ball Attach
  • Die Attach
  • Transfer Molding
  • Bump Processes
  • Packaging Business Issues
  • Substrates
  • Underfills
  • Singulation
  • Quiz: Assembly and Packaging
  • Assembly and Packaging Certificate of Completion

Testing

  • Automatic Testing Overview
  • Boundary Scan Overview
  • Defect Classes
  • Stuck-At-Fault Testing
  • Test Process Basics
  • Timing Tests in Production
  • Quiz: Testing

Final Test

  • Final Test - Semiconductor Technology Overview

Certificate

  • Semiconductor Technology Overview Certificate of Completion

Documents

  • Deposition
  • Oxidation
  • Ion Implantation
  • Chemical Mechanical Planarization
  • Lithography - Introduction
  • Lithography - Future
  • Salicide and BEOL
  • LOCOS and STI
  • Package Types
  • Package Design Principles
  • Lead Finish and Trim, Solder Ball Attach
  • Packaging Business Issues
  • Die Attach - Introduction
  • Die Attach - Temperature Issues
  • Automatic Testing Overview
  • Boundary Scan Overview
  • Stuck-At Fault Testing

Videos

  • Chip Fabrication Process
  • Micronas Wafer Fab
  • Magic Denuded Zone
  • Czochralski Crystal Growth
  • CMOS LOCOS Process Sequence Animation
  • CMOS STI
  • 180nm Process Integration
  • Packaging Overview Video
  • Wirebonding Overview Animation
  • Wafer Sawing
  • Mechanical Punch
  • Package Sawing
  • Die Attach
  • 45nm CMOS video