System Maintenance occurs every Friday.

Solder Joint Analysis

This course covers solder joints and the analysis of problems that pertain to them. We primarily focus on the solder joints between the component and the board, rather than solder joints internal to a component, but many of the concepts will apply to both. We cover solder joint basics, quality analysis techniques, processing problems and troubleshooting techniques, contamination and cleanliness, and reliability testing methods.

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Item

1-Year Online Training Subscription

(Includes this and other materials.)

Cost

$700

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Please email the printable registration form for online training to us at the email address on the form to complete your order.

Additional Information

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What Will I Learn By Taking This Class?

Course Objectives

Course Contents

Solder Joint Analysis

  • Announcements

Solder Joint Basics

  • Solder Joint Basics
  • Solder Joints - Materials and Processing
  • Solder Joint Fluxes and Underfills
  • Solder Joint Failure Mechanisms
  • Quiz: Solder Joints Basics

Contamination and Cleanliness

  • Contamination and Cleanliness
  • Electrochemical Migration Primer
  • ECM Testing and Examples
  • Introduction to Cleanliness
  • Quiz: Contamination and Cleanliness

Quality Analysis Techniques

  • Optical and SEM Analysis Techniques
  • Non Destructive Analysis Techniques
  • Structural Analysis Techniques
  • Contamination Analysis Techniques
  • Quiz: Quality Analysis Techniques

Solder Joint Reliability Testing

  • Board Level Reliability
  • Quiz: Solder Joint Reliability Testing
  • Certificate

Processing Problems and Troubleshooting Techniques

  • Cracking and Warpage Problems
  • Solder Wetting Problems and Troubleshooting Techniques
  • Quiz: Processing Problems and Troubleshooting Techniques
  • Certificate

Exam

  • Solder Joint Analysis - Final Test

Certificate

  • Solder Joint Analysis Certificate of completion

Docouments

  • Solder Joint Basics
  • Solder Joints - Materials and Processing
  • Solder Joint Fluxes and Underfills
  • Solder Joint Failure Mechanisms
  • Contamination and Cleanliness
  • Electrochemical Migration Primer
  • ECM Testing and Examples
  • Introduction to Cleanliness
  • Optical and SEM Analysis Techniques
  • Non-Destructive Analysis Techniques
  • Contamination Analysis Techniques
  • Structural Analysis Techniques
  • Board Level Reliability
  • Cracking and Warpage Problems
  • Solder Wetting Problems and Troubleshooting Techniques