What Will I Learn By Taking This Course?
Participants will learn to develop the skills to determine what failure mechanisms might occur, how to test for them, develop models for them, and eliminate them from the product. This skill building series is divided into three segments:
- Overview of Reliability Concerns with Advanced ICs. Participants will learn about the major reliability concerns associated with advanced ICs.
- Die Level Failure Mechanisms. Participants will learn the nature and manifestation of a variety of failure mechanisms that can occur at the die level in nanometer-scale ICs. These include: time-dependent dielectric breakdown, hot carrier degradation, bias temperature instabilities, electromigration, and stress-induced voiding.
- Modeling Failure Mechanisms. Participants will learn about the most current models used to characterize the die level failure mechanisms mentioned immediately above.