System Maintenance occurs every Friday.
Semiconductor reliability is at a crossroads. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and then determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability, assessing the impact of new materials, dealing with limited margins, etc. Analysis and experimentation must now account not only for material interactions on the die, but also package interactions with the die. This requires knowledge of subjects like: IC processing, new materials and materials science, chemistry, and customer expectations. While reliability levels are at an all-time high in the industry, rapid changes may quickly cause reliability to deteriorate. The industry needs competent engineers and scientists to help solve these problems. Reliability and Characterization Challenges for Advanced ICs is a 16 hour course that offers detailed instruction on a variety of subjects pertaining to semiconductor reliability and characterization. This course is designed for every manager, engineer, and technician involved in reliability, product engineering, wafer manufacturing, assembly, using semiconductor components, or supplying tools to the industry.
$700
Please email the printable registration form for online training to us at the email address on the form to complete your order.
Interested in courses where you can ask questions in real time? Public and In-House courses are available!
Participants will learn to develop the skills to determine what failure mechanisms might occur, how to test for them, develop models for them, and eliminate them from the product. This skill building series is divided into three segments: