System Maintenance occurs every Friday.

Reliability and Characterization Challenges

  1. Semiconductor reliability is at a crossroads. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and then determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability, assessing the impact of new materials, dealing with limited margins, etc. Analysis and experimentation must now account not only for material interactions on the die, but also package interactions with the die. This requires knowledge of subjects like: IC processing, new materials and materials science, chemistry, and customer expectations. While reliability levels are at an all-time high in the industry, rapid changes may quickly cause reliability to deteriorate. The industry needs competent engineers and scientists to help solve these problems. Reliability and Characterization Challenges for Advanced ICs is a 16 hour course that offers detailed instruction on a variety of subjects pertaining to semiconductor reliability and characterization. This course is designed for every manager, engineer, and technician involved in reliability, product engineering, wafer manufacturing, assembly, using semiconductor components, or supplying tools to the industry.

Register for an Account

Item

1-Year Online Training Subscription

(Includes this and other materials.)

Cost

$700

Pay Via Credit Card

Add To Shopping Cart

Pay Via Purchase Order/Check

Please email the printable registration form for online training to us at the email address on the form to complete your order.

Additional Information

Refund Policy

Interested in courses where you can ask questions in real time? Public and In-House courses are available!

What Will I Learn By Taking This Course?

Participants will learn to develop the skills to determine what failure mechanisms might occur, how to test for them, develop models for them, and eliminate them from the product. This skill building series is divided into three segments:

  1. Overview of Reliability Concerns with Advanced ICs. Participants will learn about the major reliability concerns associated with advanced ICs.
  1. Die Level Failure Mechanisms. Participants will learn the nature and manifestation of a variety of failure mechanisms that can occur at the die level in nanometer-scale ICs. These include: time-dependent dielectric breakdown, hot carrier degradation, bias temperature instabilities, electromigration, and stress-induced voiding.
  1. Modeling Failure Mechanisms. Participants will learn about the most current models used to characterize the die level failure mechanisms mentioned immediately above.

Course Objectives

  1. This course will provide participants with an in-depth understanding of the transistors, interconnect and dielectric materials used in today's advanced components.
  2. Participants will be able to understand the properties of materials and how they affect the IC.
  3. This course will identify the major failure mechanisms, explain how they are observed, how they are modeled, and how they are eliminated.
  4. Participants will be able to identify current reliability issues, how they impact the materials choices for the IC, and how they impact the overall reliability of the IC.

Course Contents

Reliability

  • Announcements
  • 4-Day Reliability Course Forum

Module 2 - Die-Level Failure Mechanisms

  • Time Dependent Dielectric Breakdown Overview
  • Hot Carrier Degradation - Overview
  • Electromigration
  • Stress Induced Voiding - Case History
  • Stress Induced Voiding

Final Test

  • Semiconductor Reliability – Final Test

Certificate

  • 4-Day Reliability Course (Online Version) Certificate

Documents

  • Reliability Distributions
  • Reliability Distribution Examples
  • Accelerated Testing Statistics
  • Populations and Sample Sizes
  • Electromigration
  • Stress Induced Voiding - Introduction
  • Ionic Contamination
  • Thermomechanical Stress - Part 1
  • Thermomechanical Stress - Part 2
  • Thermal Degradation
  • Developing Electrical Screens
  • Reliability Test Structures
  • Self Stressing Test Structures
  • Test Structures - Basics
  • Reliability Test Equipment: Wafer Level
  • Reliability Test Equipment: Probes