System Maintenance occurs every Friday.
System Maintenance occurs every Friday.
Military products require extra care when it comes to reliability. Long storage times, demanding environments, and high consequence of failure mean that products must be scrutinized in detail. This has created a number of test and evaluation challenges related to the packaging of these components. X-Ray Radiography is an 8 hour course that offers detailed instruction on the inspection of semiconductor components. This course will provide an overview of x-ray radiography and its uses for electronics component inspection. X-ray radiography is a non-destructive technique that can help localize defects and provide quality control to manufacturing/assembly processes. We will discuss how the technique works, the basic equipment for performing the technique, and more importantly, how to interpret the images. Image interpretation is the biggest challenge with x-ray radiography, so we will delve into the issues associated with image formation, package materials and structure, and how to examine data. This course is a must for quality control engineers, and product engineers who read reports with this data, or engineers working at companies that supply tools to the industry.
$700
Please email the printable registration form for online training to us at the email address on the form to complete your order.
Interested in courses where you can ask questions in real time? Public and In-House courses are available!
By focusing on the fundamentals of x-ray radiography, participants will learn how to inspect components for a project. Our instructors work hard to explain packaging evaluation without delving heavily into the complex electrical engineering, and materials science that normally accompany this discipline. This skill-building series is divided into three segments:
1. The Fundamentals of Electronics Packaging. Participants will learn to recognize common features and structures associated with the packaging used in today’s semiconductor electronic components.
2. X-Ray Imaging and Interpretation. Participants will learn about the physics of x-ray imaging, and how the x-rays interact with various materials to create the contrast seen in the image. Building on this concept, participants will then learn how to interpret the information seen in the x-ray image, so that they can make determinations as to the presence of defects, the approximate distances seen in the features in the images, and whether different imaging parameters might be needed to generate a higher quality image.
3. Case Histories. Participants will identify how to use their knowledge through the case histories. Participants will learn to identify key pieces of information that allow them to determine whether or not a defect or anomaly violates the MIL-STD requirements, and how to proceed.